MSP430FR6922 16 MHz Ultra-Low-Power MCU featuring 64 KB FRAM, 2 KB SRAM, 52 IO, ADC12, LCD, AES 64-VQFN -40 to 85
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | QFN |
| package instruction | HVQCCN, LCC64,.35SQ,20 |
| Contacts | 64 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 12 weeks |
| Has ADC | YES |
| Address bus width | |
| bit size | 16 |
| boundary scan | YES |
| CPU series | MSP430 |
| maximum clock frequency | 24 MHz |
| DAC channel | NO |
| DMA channel | YES |
| External data bus width | |
| JESD-30 code | S-PQCC-N64 |
| JESD-609 code | e4 |
| length | 9 mm |
| low power mode | YES |
| Humidity sensitivity level | 3 |
| Number of DMA channels | 3 |
| Number of I/O lines | 52 |
| Number of terminals | 64 |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC64,.35SQ,20 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| RAM (bytes) | 2048 |
| rom(word) | 65536 |
| ROM programmability | FRAM |
| Maximum seat height | 1 mm |
| speed | 16 MHz |
| Maximum supply voltage | 3.6 V |
| Minimum supply voltage | 1.8 V |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 9 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |
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