Digital Bus Switch ICs 2.5V 3.3V LO VLTG HI BandwidthBus Switch
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | TSSOP |
| package instruction | TSSOP, TSSOP20,.25 |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| series | CB3Q/3VH/3C/2B |
| JESD-30 code | R-PDSO-G20 |
| JESD-609 code | e4 |
| length | 6.5 mm |
| Logic integrated circuit type | BUS DRIVER |
| Humidity sensitivity level | 1 |
| Number of digits | 4 |
| Number of functions | 2 |
| Number of ports | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP20,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 2.5/3.3 V |
| propagation delay (tpd) | 0.2 ns |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.3 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 4.4 mm |
| SN74CB3Q3244PWE4 | SN74CB3Q3244PWRG4 | SN74CB3Q3244 | |
|---|---|---|---|
| Description | Digital Bus Switch ICs 2.5V 3.3V LO VLTG HI BandwidthBus Switch | Digital Bus Switch ICs 2.5V 3.3V LO VLTG HI BandwidthBus Switch | SN74CB3Q3244 8-Bit FET Bus Switch 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch |
| Is it lead-free? | Lead free | Lead free | - |
| Is it Rohs certified? | conform to | conform to | - |
| Maker | Texas Instruments | Texas Instruments | - |
| Parts packaging code | TSSOP | TSSOP | - |
| package instruction | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | - |
| Contacts | 20 | 20 | - |
| Reach Compliance Code | unknown | unknown | - |
| series | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | - |
| JESD-30 code | R-PDSO-G20 | R-PDSO-G20 | - |
| JESD-609 code | e4 | e4 | - |
| length | 6.5 mm | 6.5 mm | - |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | - |
| Humidity sensitivity level | 1 | 1 | - |
| Number of digits | 4 | 4 | - |
| Number of functions | 2 | 2 | - |
| Number of ports | 2 | 2 | - |
| Number of terminals | 20 | 20 | - |
| Maximum operating temperature | 85 °C | 85 °C | - |
| Minimum operating temperature | -40 °C | -40 °C | - |
| Output characteristics | 3-STATE | 3-STATE | - |
| Output polarity | TRUE | TRUE | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | TSSOP | TSSOP | - |
| Encapsulate equivalent code | TSSOP20,.25 | TSSOP20,.25 | - |
| Package shape | RECTANGULAR | RECTANGULAR | - |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| Peak Reflow Temperature (Celsius) | 260 | 260 | - |
| power supply | 2.5/3.3 V | 2.5/3.3 V | - |
| propagation delay (tpd) | 0.2 ns | 0.2 ns | - |
| Certification status | Not Qualified | Not Qualified | - |
| Maximum seat height | 1.2 mm | 1.2 mm | - |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | - |
| Minimum supply voltage (Vsup) | 2.3 V | 2.3 V | - |
| Nominal supply voltage (Vsup) | 2.5 V | 2.5 V | - |
| surface mount | YES | YES | - |
| technology | CMOS | CMOS | - |
| Temperature level | INDUSTRIAL | INDUSTRIAL | - |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| Terminal form | GULL WING | GULL WING | - |
| Terminal pitch | 0.65 mm | 0.65 mm | - |
| Terminal location | DUAL | DUAL | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - |
| width | 4.4 mm | 4.4 mm | - |
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