EEPROM, 128KX8, 200ns, Parallel, CMOS, CPGA30, CERAMIC, PGA-30
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | PGA |
package instruction | PGA, |
Contacts | 30 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 200 ns |
Other features | AUTOMATIC WRITE |
JESD-30 code | R-CPGA-P30 |
JESD-609 code | e0 |
length | 16.51 mm |
memory density | 1048576 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 30 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 128KX8 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 |
Maximum seat height | 3.9878 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 13.97 mm |
Maximum write cycle time (tWC) | 10 ms |
Base Number Matches | 1 |