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BZX84B4V3-TP

Description
Zener Diode, 4.3V V(Z), 2%, 0.35W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-3
CategoryDiscrete semiconductor    diode   
File Size420KB,6 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
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BZX84B4V3-TP Overview

Zener Diode, 4.3V V(Z), 2%, 0.35W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-3

BZX84B4V3-TP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance90 Ω
JESD-30 codeR-PDSO-G3
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.35 W
Certification statusNot Qualified
Nominal reference voltage4.3 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance2%
Working test current5 mA
Base Number Matches1
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

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BZX84C2V4
THRU
BZX84C(B)51
Silicon
350 mWatt
Zener Diodes
Features
Planar Die construction
350mW Power Dissipation
Zener Voltages from 2.4V - 51V
Ideally Suited for Automated Assembly Processes
Halogen
free available upon request by adding suffix "-HF"
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
Weight: 0.008 grams (approx.)
F
E
A
D
SOT-23
C
B
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Maximum Forward
V
F
Voltage@IF=10mA
Power Dissipation
P
(AV)
(NoteA)
Operation And
T
J
, T
STG
Storage
Temperature
Peak Forward Surge I
FSM
Current(NoteB)
Thermal Resistance
(Note C)
Rthja
0.9
350
-55 C to
+150
o
C
2.0
357
o
V
mWatt
G
K
H
J
L
DIMENSIONS
o
A
C/W
DIM
A
B
C
D
E
F
G
H
J
K
L
INCHES
MIN
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
.007
MAX
.120
.104
.055
.041
.081
.024
.0039
.044
.007
.020
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
.20
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
.50
NOTE
NOTES:
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or
equivalent square wave, duty cycle = 4 pulses per
minute maximum.
C. Valid provided the terminals are kept at ambient
temperature
*Pin Configuration - Top View
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
Revision: C
www.mccsemi.com
1 of
6
2013/05/20

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