EEPROM Module, 128KX32, 140ns, Parallel, CMOS, CQMA68, CERAMIC, QFP-68
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Objectid | 1820316487 |
| Parts packaging code | QFP |
| package instruction | CERAMIC, QFP-68 |
| Contacts | 68 |
| Reach Compliance Code | compliant |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 140 ns |
| Other features | USER CONFIGURABLE AS 512K X 8 |
| Spare memory width | 16 |
| JESD-30 code | S-CQMA-F68 |
| JESD-609 code | e0 |
| memory density | 4194304 bit |
| Memory IC Type | EEPROM MODULE |
| memory width | 32 |
| Number of functions | 1 |
| Number of terminals | 68 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 128KX32 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| Package shape | SQUARE |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Programming voltage | 5 V |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | FLAT |
| Terminal location | QUAD |
| Maximum write cycle time (tWC) | 10 ms |
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