DATASHEET
LOW EMI CLOCK GENERATOR
Description
The IDT5V50015 generates a low EMI output clock from a
clock or crystal input. The part is designed to dither the LCD
interface clock for PDAs, printers, scanners, modems,
copiers, and others. Using IDT’s proprietary mix of analog
and digital Phase-Locked Loop (PLL) technology, the
device spreads the frequency spectrum of the output,
reducing the frequency amplitude peaks by several dB.
IDT offers many other clocks for computers and computer
peripherals. Consult IDT when you need to remove crystals
and oscillators from your board.
IDT5V50015
Features
•
•
•
•
Packaged in 8-pin SOIC/TSSOP
Provides a spread spectrum output clock
135 MHz to 200 MHz operation
Accepts a clock input (provides same frequency dithered
output)
•
Center spread modulation
•
Peak reduction by 8 dB to 16 dB typical on 3rd through
19th odd harmonics
•
Low EMI feature can be disabled
•
Operating voltage of 3.3 V
•
Advanced, low-power CMOS process
Block Diagram
VDD
S1:0
SSCC
2
PLL Clock
Synthesis
and Spread
Spectrum
Circuitry
SSCLK
ICLK
GND
IDT™
LOW EMI CLOCK GENERATOR
1
IDT5V50015
REV F 031109
IDT5V50015
LOW EMI CLOCK GENERATOR
SSCG
Pin Assignment
ICLK
VDD
GND
SSCLK
1
2
3
4
8
7
6
5
VDD
S0
S1
SSCC
Spread Direction and Percentage
Select Table
S1
Pin 6
S0
Pin 7
Spread
Direction
Spread
Percentage
0
0
1
1
0
1
0
1
Center
Center
Center
Center
±0.5
±1.0
±1.5
±2.0
8 pin (150 mil) SOIC/TSSOP
0 = connect to GND
1 = connect directly to VDD
Pin Descriptions
Pin
Number
Pin
Name
Pin Type
Pin Description
1
2
3
4
5
6
7
8
ICLK
VDD
GND
SSCLK
SSCC
S1
S0
VDD
Input
Power
Power
Output
Input
Input
Input
Power
Connect to a 130–200 MHz clock input.
Connect to +3.3 V.
Connect to ground.
Clock output with spread spectrum.
Spread spectrum enable/disable function. SSCC function is enabled when
input is high and disabled when input is low. This pin is pulled high internally.
Function select 1 input. Selects spread amount and direction per table above.
Internal pull-down.
Function select 0 input. Selects spread amount and direction per table above.
Internal pull-down.
Connect to +3.3 V.
IDT™
LOW EMI CLOCK GENERATOR
2
IDT5V50015
REV F 031109
IDT5V50015
LOW EMI CLOCK GENERATOR
SSCG
External Components
The IDT5V50015 requires a minimum number of external
components for proper operation.
Spread Spectrum Profile
The IDT5V50015 low EMI clock generator uses an
optimized frequency slew rate algorithm to facilitate down
stream tracking of zero delay buffers and other PLL devices.
The frequency modulation amplitude is constant with
variations of the input frequency.
Decoupling Capacitor
A decoupling capacitor of 0.01µF must be connected
between VDD and GND on pins 2 and 3, as close to these
pins as possible. For optimum device performance, the
decoupling capacitor should be mounted on the component
side of the PCB. Avoid the use of vias in the decoupling
circuit.
Modulation Rate
Series Termination Resistor
When the PCB trace between the clock output and the load
is over 1 inch, series termination should be used. To series
terminate a 50Ω trace (a commonly used trace impedance)
place a 33Ω resistor in series with the clock line, as close to
the clock output pin as possible. The nominal impedance of
the clock output is 20Ω
.
Frequency
Time
PCB Layout Recommendations
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
1) The 0.01µF decoupling capacitor should be mounted on
the component side of the board as close to the VDD pin as
possible. No vias should be used between the decoupling
capacitor and VDD pin. The PCB trace to VDD pin should
be kept as short as possible, as should the PCB trace to the
ground via.
2) To minimize EMI, the 33Ω series termination resistor (if
needed) should be placed close to the clock output.
3) An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers. Other signal traces should be routed away from the
IDT5V50015. This includes signal traces just underneath
the device, or on layers adjacent to the ground plane layer
used by the device.
IDT™
LOW EMI CLOCK GENERATOR
3
IDT5V50015
REV F 031109
IDT5V50015
LOW EMI CLOCK GENERATOR
SSCG
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the IDT5V50015. These ratings, which
are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at
these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Item
Supply Voltage, VDD
All Inputs and Outputs
Ambient Operating Temperature
Storage Temperature
Junction Temperature
Soldering Temperature
7V
Rating
-0.5 V to VDD+0.5 V
0 to +70° C
-65 to +150° C
125° C
260° C
Recommended Operation Conditions
Parameter
Ambient Operating Temperature
Power Supply Voltage (measured in respect to GND)
Min.
0
+3.0
Typ.
Max.
+70
3.6
Units
°
C
V
Thermal Characteristics for 8TSSOP
Parameter
Thermal Resistance Junction to
Ambient
Symbol
θ
JA
θ
JA
θ
JA
θ
JC
Conditions
Still air
1 m/s air flow
3 m/s air flow
Min.
Typ.
110
100
80
35
Max. Units
°
C/W
°
C/W
°
C/W
°
C/W
Thermal Resistance Junction to Case
Thermal Characteristics for 8SOIC
Parameter
Thermal Resistance Junction to
Ambient
Symbol
θ
JA
θ
JA
θ
JA
θ
JC
Ψ
JT
Conditions
Still air
1 m/s air flow
3 m/s air flow
Still air
Min.
Typ.
150
140
120
40
20
Max. Units
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
Thermal Resistance Junction to Case
Thermal Resistance Junction to Top
of Case
IDT™
LOW EMI CLOCK GENERATOR
4
IDT5V50015
REV F 031109
IDT5V50015
LOW EMI CLOCK GENERATOR
SSCG
DC Electrical Characteristics
Unless stated otherwise,
VDD = 3.3 V,
Ambient Temperature 0 to +70° C
Parameter
Operating Voltage
Supply Current
Input High Voltage
Input Low Voltage
Output High Voltage
Output Low Voltage
Input Capacitance
Pull-down Resistance
Pull-up Resistance
Note 1:
CL = 15 pF.
Symbol
VDD
IDD
V
IH
V
IL
V
OH
V
OL
C
IN1
R
PD
R
PU
Conditions
ICLK=150 MHz, Note 1
ICLK=200 MHz, Note 1
S1: S0
S1: S0
I
OH
= -6 mA
I
OH
=- 20 mA
I
OL
= 6 mA
I
OL
= 20 mA
All inputs
S1, S0
SSCC
Min.
3.0
Typ.
3.3
40
50
Max.
3.6
Units
V
mA
mA
V
2.0
0.8
2.4
2.0
0.4
1.2
3
4
240
240
5
V
V
V
V
V
pF
kΩ
kΩ
AC Electrical Characteristics
Unless stated otherwise,
VDD = 3.3 V,
Ambient Temperature 0 to +70° C
Parameter
Input Clock Frequency
Output Clock Frequency
Output Clock Duty Cycle
Cycle to cycle Jitter
Output Rise Time
Output Fall Time
Modulation Frequency
Symbol
Conditions
Min.
135
135
Typ.
Max. Units
200
200
MHz
MHz
%
ps
ps
ns
ns
kHz
All outputs
ICLK=150 MHz, SS on
ICLK=200 MHz, SS on
t
R
t
F
20% to 80%, CL=15 pF, 150 MHz
80% to 20%, CL=15 pF, 150 MHz
ICLK=200 MHz
ICLK=150 MHz
ICLK=130 MHz
47
50
50
75
0.9
0.9
51.2
38.4
32
53
100
100
IDT™
LOW EMI CLOCK GENERATOR
5
IDT5V50015
REV F 031109
RF/Wirelessly
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