EE PLD, 7.5ns, 256-Cell, CMOS, PBGA256, FINE LINE, BGA-256
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Intel |
package instruction | BGA, BGA256,16X16,40 |
Reach Compliance Code | compliant |
ECCN code | 3A991 |
Other features | YES |
maximum clock frequency | 126.6 MHz |
In-system programmable | YES |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e1 |
JTAG BST | YES |
length | 17 mm |
Humidity sensitivity level | 3 |
Dedicated input times | |
Number of I/O lines | 164 |
Number of macro cells | 256 |
Number of terminals | 256 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 0 DEDICATED INPUTS, 164 I/O |
Output function | MACROCELL |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA256,16X16,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 2.5/3.3,3.3 V |
Programmable logic type | EE PLD |
propagation delay | 7.5 ns |
Certification status | Not Qualified |
Maximum seat height | 2.1 mm |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 3 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 17 mm |
Base Number Matches | 1 |