DS2013N-50 datasheet, PDF - EEWORLD Datasheet

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DS2013N-50: DescriptionFIFO, 8KX9, 50ns, Asynchronous, CMOS, PDIP28,; Categorystorage storage; File Size55KB，1 Pages; ManufacturerDALLAS; Websitehttp://www.dalsemi.com

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DS2013N-50 Overview

FIFO, 8KX9, 50ns, Asynchronous, CMOS, PDIP28,

DS2013N-50 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	DALLAS
Reach Compliance Code	unknown
Maximum access time	50 ns
Other features	RETRANSMIT
Maximum clock frequency (fCLK)	15.38 MHz
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
memory density	73728 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8KX9
Output characteristics	3-STATE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.002 A
Maximum slew rate	0.12 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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DS2013N-50 Related Products

	DS2013N-50	DS2013N-80	DS2013N-65	DS2013-80	DS2013-50
Description	FIFO, 8KX9, 50ns, Asynchronous, CMOS, PDIP28,	FIFO, 8KX9, 80ns, Asynchronous, CMOS, PDIP28,	FIFO, 8KX9, 65ns, Asynchronous, CMOS, PDIP28,	FIFO, 8KX9, 80ns, Asynchronous, CMOS, PDIP28,	FIFO, 8KX9, 50ns, Asynchronous, CMOS, PDIP28,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Maximum access time	50 ns	80 ns	65 ns	80 ns	50 ns
Maximum clock frequency (fCLK)	15.38 MHz	10 MHz	12.5 MHz	10 MHz	15.38 MHz
JESD-30 code	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0	e0
memory density	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9	9
Number of functions	1	1	1	1	1
Number of terminals	28	28	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	70 °C	70 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-
organize	8KX9	8KX9	8KX9	8KX9	8KX9
Exportable	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A
Maximum slew rate	0.12 mA	0.12 mA	0.12 mA	0.12 mA	0.12 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	DALLAS	-	DALLAS	DALLAS	DALLAS
Other features	RETRANSMIT	-	-	RETRANSMIT	RETRANSMIT
Output characteristics	3-STATE	-	-	3-STATE	3-STATE

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