M27C256B-60XN6X datasheet, PDF

M27C256B-60XN6X: Description32K X 8 UVPROM, 90 ns, CDIP28; Categorystorage storage; File Size113KB，16 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M27C256B-60XN6X Overview

32K X 8 UVPROM, 90 ns, CDIP28

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	TSOP
package instruction	8 X 13.40 MM, PLASTIC, TSOP-28
Contacts	28
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum access time	60 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G28
JESD-609 code	e0
length	11.8 mm
memory density	262144 bi
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP28,.53,22
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	12.75 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.55 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

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