LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Parts packaging code | DIP |
| package instruction | PLASTIC, DIP-16 |
| Contacts | 16 |
| Reach Compliance Code | not_compliant |
| series | LS |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 15 pF |
| Logic integrated circuit type | MULTIPLEXER |
| MaximumI(ol) | 0.008 A |
| Number of functions | 4 |
| Number of entries | 2 |
| Output times | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output polarity | TRUE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum supply current (ICC) | 16 mA |
| Prop。Delay @ Nom-Sup | 27 ns |
| propagation delay (tpd) | 27 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.1 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| T74LS157B1 | T74LS157M1 | T74LS157C1 | T74LS157D1 | |
|---|---|---|---|---|
| Description | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16 | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, SO-16 | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PQCC20, PLASTIC, LCC-20 | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 |
| Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Parts packaging code | DIP | SOIC | QLCC | DIP |
| package instruction | PLASTIC, DIP-16 | SO-16 | PLASTIC, LCC-20 | DIP, DIP16,.3 |
| Contacts | 16 | 16 | 20 | 16 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | not_compliant |
| series | LS | LS | LS | LS |
| JESD-30 code | R-PDIP-T16 | R-PDSO-G16 | S-PQCC-J20 | R-GDIP-T16 |
| Load capacitance (CL) | 15 pF | 15 pF | 15 pF | 15 pF |
| Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| Number of functions | 4 | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 | 2 |
| Output times | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 20 | 16 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Output polarity | TRUE | TRUE | TRUE | TRUE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | SOP | QCCJ | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | CHIP CARRIER | IN-LINE |
| Maximum supply current (ICC) | 16 mA | 16 mA | 16 mA | 16 mA |
| propagation delay (tpd) | 27 ns | 27 ns | 27 ns | 27 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.1 mm | 1.75 mm | 4.57 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | GULL WING | J BEND | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL |
| width | 7.62 mm | 3.9 mm | 8.9662 mm | 7.62 mm |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible |
| JESD-609 code | e0 | e0 | - | e0 |
| MaximumI(ol) | 0.008 A | 0.008 A | - | 0.008 A |
| Encapsulate equivalent code | DIP16,.3 | SOP16,.25 | - | DIP16,.3 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| power supply | 5 V | 5 V | - | 5 V |
| Prop。Delay @ Nom-Sup | 27 ns | 27 ns | - | 27 ns |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
