Multiplexer, 1-Func, 8 Line Input, TTL, CDFP14,
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Fairchild |
package instruction | DFP, FL14,.3 |
Reach Compliance Code | compliant |
JESD-30 code | R-XDFP-F14 |
JESD-609 code | e0 |
Logic integrated circuit type | MULTIPLEXER |
Humidity sensitivity level | 2A |
Number of functions | 1 |
Number of entries | 8 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DFP |
Encapsulate equivalent code | FL14,.3 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | 250 |
Certification status | Not Qualified |
surface mount | YES |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
Base Number Matches | 1 |
54152AFM | 74152AFC | |
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Description | Multiplexer, 1-Func, 8 Line Input, TTL, CDFP14, | Multiplexer, 1-Func, 8 Line Input, TTL, CDFP14, |
Is it lead-free? | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible |
Maker | Fairchild | Fairchild |
package instruction | DFP, FL14,.3 | DFP, FL14,.3 |
Reach Compliance Code | compliant | compliant |
JESD-30 code | R-XDFP-F14 | R-XDFP-F14 |
JESD-609 code | e0 | e0 |
Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER |
Humidity sensitivity level | 2A | 2A |
Number of functions | 1 | 1 |
Number of entries | 8 | 8 |
Number of terminals | 14 | 14 |
Maximum operating temperature | 125 °C | 70 °C |
Package body material | CERAMIC | CERAMIC |
encapsulated code | DFP | DFP |
Encapsulate equivalent code | FL14,.3 | FL14,.3 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | FLATPACK |
Peak Reflow Temperature (Celsius) | 250 | 250 |
Certification status | Not Qualified | Not Qualified |
surface mount | YES | YES |
technology | TTL | TTL |
Temperature level | MILITARY | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | FLAT | FLAT |
Terminal pitch | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | 30 |
Base Number Matches | 1 | 1 |