IS61LV2568LL-15K datasheet, PDF

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IS61LV2568LL-15K: DescriptionStandard SRAM, 256KX8, 15ns, CMOS, PDSO36, 0.400 INCH, SOJ-36; Categorystorage storage; File Size55KB，11 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS61LV2568LL-15K Overview

Standard SRAM, 256KX8, 15ns, CMOS, PDSO36, 0.400 INCH, SOJ-36

IS61LV2568LL-15K Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	SOJ
package instruction	0.400 INCH, SOJ-36
Contacts	36
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	15 ns
JESD-30 code	R-PDSO-J36
JESD-609 code	e0
length	23.5 mm
memory density	2097152 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	36
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOJ
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	3.76 mm
Maximum supply voltage (Vsup)	3.63 V
Minimum supply voltage (Vsup)	2.97 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm
Base Number Matches	1

IS61LV2568LL-15K Related Products

	IS61LV2568LL-15K	IS61LV2568L-10K	IS61LV2568LL-12K	IS61LV2568LL-15B	IS61LV2568LL-12B	IS61LV2568LL-15TI	IS61LV2568L-10B	IS61LV2568LL-15BI	IS61LV2568LL-15KI	IS61LV2568LL-15T
Description	Standard SRAM, 256KX8, 15ns, CMOS, PDSO36, 0.400 INCH, SOJ-36	Standard SRAM, 256KX8, 10ns, CMOS, PDSO36, 0.400 INCH, SOJ-36	Standard SRAM, 256KX8, 12ns, CMOS, PDSO36, 0.400 INCH, SOJ-36	Standard SRAM, 256KX8, 15ns, CMOS, PBGA36, 6 X 8 MM, MINI, BGA-36	Standard SRAM, 256KX8, 12ns, CMOS, PBGA36, 6 X 8 MM, MINI, BGA-36	Standard SRAM, 256KX8, 15ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 256KX8, 10ns, CMOS, PBGA36, 6 X 8 MM, MINI, BGA-36	Standard SRAM, 256KX8, 15ns, CMOS, PBGA36, 6 X 8 MM, MINI, BGA-36	Standard SRAM, 256KX8, 15ns, CMOS, PDSO36, 0.400 INCH, SOJ-36	Standard SRAM, 256KX8, 15ns, CMOS, PDSO44, TSOP2-44
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	SOJ	SOJ	SOJ	BGA	BGA	TSOP2	BGA	BGA	SOJ	TSOP2
package instruction	0.400 INCH, SOJ-36	0.400 INCH, SOJ-36	0.400 INCH, SOJ-36	6 X 8 MM, MINI, BGA-36	6 X 8 MM, MINI, BGA-36	TSOP2-44	6 X 8 MM, MINI, BGA-36	6 X 8 MM, MINI, BGA-36	0.400 INCH, SOJ-36	TSOP2-44
Contacts	36	36	36	36	36	44	36	36	36	44
Reach Compliance Code	compliant	compli	compliant	compliant	compliant	compliant	compli	compli	compli	compli
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	15 ns	10 ns	12 ns	15 ns	12 ns	15 ns	10 ns	15 ns	15 ns	15 ns
JESD-30 code	R-PDSO-J36	R-PDSO-J36	R-PDSO-J36	R-PBGA-B36	R-PBGA-B36	R-PDSO-G44	R-PBGA-B36	R-PBGA-B36	R-PDSO-J36	R-PDSO-G44
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	23.5 mm	23.5 mm	23.5 mm	10 mm	10 mm	18.41 mm	10 mm	10 mm	23.5 mm	18.41 mm
memory density	2097152 bit	2097152 bi	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bi	2097152 bi	2097152 bi	2097152 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	36	36	36	36	36	44	36	36	36	44
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	85 °C	70 °C	85 °C	85 °C	70 °C
organize	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOJ	SOJ	SOJ	LFBGA	LFBGA	TSOP2	LFBGA	LFBGA	SOJ	TSOP2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	240	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	240
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.76 mm	3.76 mm	3.76 mm	1.35 mm	1.35 mm	1.2 mm	1.35 mm	1.35 mm	3.76 mm	1.2 mm
Maximum supply voltage (Vsup)	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V
Minimum supply voltage (Vsup)	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	J BEND	BALL	BALL	GULL WING	BALL	BALL	J BEND	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	0.75 mm	0.75 mm	0.8 mm	0.75 mm	0.75 mm	1.27 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	BOTTOM	BOTTOM	DUAL	BOTTOM	BOTTOM	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30
width	10.16 mm	10.16 mm	10.16 mm	8 mm	8 mm	10.16 mm	8 mm	8 mm	10.16 mm	10.16 mm
Humidity sensitivity level	3	3	3	3	3	-	3	3	3	-
Base Number Matches	1	1	1	1	1	1	-	-	-	-
Maker	-	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	-	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )

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