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S71PL032J40BFI0K0

Description
Memory Circuit, Flash+PSRAM, 2MX16, CMOS, PBGA56, 9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Categorystorage    storage   
File Size6MB,196 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
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S71PL032J40BFI0K0 Overview

Memory Circuit, Flash+PSRAM, 2MX16, CMOS, PBGA56, 9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

S71PL032J40BFI0K0 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeBGA
package instruction9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Contacts56
Reach Compliance Codeunknown
Maximum access time70 ns
Other featuresPSRAM IS ORGANIZED AS 256K X 16
JESD-30 codeR-PBGA-B56
JESD-609 codee1
length9 mm
memory density33554432 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Mixed memory typesFLASH+PSRAM
Humidity sensitivity level3
Number of functions1
Number of terminals56
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA56,8X8,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.000005 A
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width7 mm
Base Number Matches1

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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