EE PLD, 5.5 ns, PQFP100
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Lattice |
Parts packaging code | BGA |
package instruction | FPBGA-256 |
Contacts | 256 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Other features | YES |
maximum clock frequency | 76.9 MHz |
In-system programmable | YES |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e0 |
JTAG BST | YES |
length | 17 mm |
Humidity sensitivity level | 3 |
Dedicated input times | 14 |
Number of I/O lines | 128 |
Number of macro cells | 256 |
Number of terminals | 256 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 14 DEDICATED INPUTS, 128 I/O |
Output function | MACROCELL |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA256,16X16,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 3.3 V |
Programmable logic type | EE PLD |
propagation delay | 7.5 ns |
Certification status | Not Qualified |
Maximum seat height | 2.1 mm |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 3 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 17 mm |
Base Number Matches | 1 |