Cache SRAM, 64KX16, 25ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SO-44
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Hitachi (Renesas ) |
Parts packaging code | SOIC |
package instruction | SOJ, SOJ44,.44 |
Contacts | 44 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 25 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-J44 |
JESD-609 code | e0 |
length | 28.33 mm |
memory density | 1048576 bit |
Memory IC Type | CACHE SRAM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOJ |
Encapsulate equivalent code | SOJ44,.44 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 3.76 mm |
Maximum standby current | 0.00008 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.1 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 10.16 mm |
Base Number Matches | 1 |
HM62W1664HBLJP-25 | HM62W1664HBLJP-30 | HM62W1664HBJP-30 | HM62W1664HBJP-25 | |
---|---|---|---|---|
Description | Cache SRAM, 64KX16, 25ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SO-44 | Cache SRAM, 64KX16, 30ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SO-44 | 64KX16 CACHE SRAM, 30ns, PDSO44, 0.400 INCH, PLASTIC, SOJ-44 | 64KX16 CACHE SRAM, 25ns, PDSO44, 0.400 INCH, PLASTIC, SOJ-44 |
Maker | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
Parts packaging code | SOIC | SOIC | SOJ | SOJ |
package instruction | SOJ, SOJ44,.44 | SOJ, SOJ44,.44 | SOJ, SOJ44,.44 | SOJ, SOJ44,.44 |
Contacts | 44 | 44 | 44 | 44 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Maximum access time | 25 ns | 30 ns | 30 ns | 25 ns |
I/O type | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-J44 |
length | 28.33 mm | 28.33 mm | 28.33 mm | 28.33 mm |
memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
Memory IC Type | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
memory width | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 44 | 44 | 44 | 44 |
word count | 65536 words | 65536 words | 65536 words | 65536 words |
character code | 64000 | 64000 | 64000 | 64000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOJ | SOJ | SOJ | SOJ |
Encapsulate equivalent code | SOJ44,.44 | SOJ44,.44 | SOJ44,.44 | SOJ44,.44 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.76 mm | 3.76 mm | 3.76 mm | 3.76 mm |
Maximum standby current | 0.00008 A | 0.00008 A | 0.035 A | 0.04 A |
Minimum standby current | 2 V | 2 V | 3 V | 3 V |
Maximum slew rate | 0.1 mA | 0.09 mA | 0.09 mA | 0.1 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | J BEND | J BEND | J BEND | J BEND |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
width | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
Base Number Matches | 1 | 1 | 1 | 1 |
Is it Rohs certified? | incompatible | incompatible | - | incompatible |
JESD-609 code | e0 | e0 | - | e0 |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |