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Document 1575-1
Shielded Power Inductors –
XGL4030
Halogen
Free
Q200
+
125°C
AEC
• Industry’s lowest DCR and ultra low AC losses over a wide
frequency range
• AEC-Q200 Grade 1 qualified (–40°C to +125°C ambient)
• Superior current handling with soft saturation characteristics
• Wide inductance range up to 12
µ
H
Core material
Composite
Core and winding loss
See www.coilcraft.com/coreloss
Environmental
RoHS compliant, halogen free
Terminations
RoHS compliant tin-silver (96.5/3.5) over copper. Other
terminations available at additional cost.
Weight:
0.27– 0.30 g
Operating voltage:
0 – 80 V
Ambient temperature
–40°C to +125°C with (40°C rise)
Irms
current.
Maximum part temperature
+165°C (ambient + temp rise). Derating.
Storage temperature
Component: –55°C to +165°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time (FIT) / Mean Time Between Failures (MTBF)
38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332
PCB washing
Tested to MIL-STD-202 Method 215 plus an additional
aqueous wash. See
Doc787_PCB_Washing.pdf.
Part
XGL4030-131ME_
XGL4030-271ME_
XGL4030-301ME_
XGL4030-401ME_
XGL4030-471ME_
XGL4030-621ME_
XGL4030-761ME_
XGL4030-102ME_
XGL4030-122ME_
XGL4030-152ME_
XGL4030-222ME_
XGL4030-332ME_
XGL4030-472ME_
XGL4030-562ME_
XGL4030-682ME_
XGL4030-822ME_
XGL4030-103ME_
XGL4030-123ME_
number
1
Inductance
2
±20% (µH)
0.13
0.27
0.30
0.40
0.47
0.62
0.76
1.0
1.2
1.5
2.2
3.3
4.7
5.6
6.8
8.2
10.0
12.0
DCR (mOhms)
3
nom
max
1.5
1.8
2.2
2.4
2.5
2.9
2.8
3.2
3.4
3.9
4.1
4.6
4.9
5.5
6.5
7.2
8.5
9.4
9.5
10.5
13.5
15.0
19.9
21.9
28.5
31.5
31.5
34.7
43.5
47.9
50.6
55.7
63.0
69.5
78.5
86.5
SRF typ
4
(MHz)
265
160
130
120
100
82
72
65
55
50
40
30
26
25
22
20
18.5
17
Isat
(A)
5
10% drop 20% drop 30% drop
12.5
19.5
26.5
9.2
14.4
19.3
8.0
12.5
17.0
7.2
11.5
15.5
6.8
10.6
14.2
6.1
9.5
12.7
5.6
8.7
11.8
4.8
7.6
10.3
4.2
6.8
9.2
3.8
6.3
8.8
3.1
5.0
7.0
2.4
3.8
5.3
2.1
3.2
4.4
2.0
3.1
4.2
1.8
2.7
3.65
1.65
2.55
3.45
1.4
2.3
3.1
1.35
2.05
2.7
Irms
(A)
6
20°C rise 40°C rise
21.0
27.0
17.5
24.2
17.0
24.0
15.5
22.5
15.3
21.2
12.5
15.0
12.3
14.2
10.8
13.0
9.5
12.2
7.0
10.2
5.8
8.7
5.4
7.5
4.8
6.6
4.0
5.5
3.5
4.7
3.1
4.2
2.9
3.9
2.5
3.4
1. When ordering, please specify
termination
and
packaging
codes:
XGL4030-123MEC
Termination: E
= RoHS compliant tin-silver over copper.
Special order: T
= RoHS tin-silver-copper (95.5/4/0.5) or
S
= non-RoHS tin-lead (63/37).
Packaging: C
= 7″ machine-ready reel. EIA-481 embossed plastic tape. Quantities less than full reel
available: in tape (not machine ready) or with leader and trailer ($25 charge).
D
= 13″ machine-ready reel. EIA-481 embossed plastic tape. Factory order only, not stocked.
2. Inductance tested at 1 MHz, 0.1 Vrms, 0 Adc.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using Agilent/HP 4395A or equivalent.
5. DC current at 25°C that causes the specified inductance drop from its value without current.
Click for temperature derating information.
6. Current that causes the specified temperature rise from 25°C ambient. This information is for reference only
and does not represent absolute maximum ratings.
Click for temperature derating information.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Irms
Testing
Irms
testing was performed on
0.75 inch wide × 0.25 inch thick
copper traces in still air.
Temperature rise is highly
dependent on many factors
including pcb land pattern,
trace size, and proximity to
other components. Therefore
temperature rise should be
verified in application conditions.
Specifications subject to change without notice.
Please check our website for latest information.
Document 1575-1
Revised 10/04/19
Test/Measurement
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