Fast Page DRAM, 1MX1, 100ns, CMOS, CDIP18, 0.400 INCH, CERAMIC, DIP-18
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Maker | Micross |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 18 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| access mode | FAST PAGE |
| Maximum access time | 100 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 code | R-CDIP-T18 |
| JESD-609 code | e0 |
| length | 22.86 mm |
| memory density | 1048576 bit |
| Memory IC Type | FAST PAGE DRAM |
| memory width | 1 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 18 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 1MX1 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum seat height | 3.93 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 10.16 mm |
| Base Number Matches | 1 |
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