EEPROM, 32KX8, 85ns, Parallel, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOP-28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Hitachi (Renesas ) |
Parts packaging code | SOIC |
package instruction | SOP, SOP28,.4 |
Contacts | 28 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 85 ns |
command user interface | NO |
Data polling | YES |
Durability | 100000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G28 |
JESD-609 code | e0 |
length | 18.3 mm |
memory density | 262144 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 32KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP28,.4 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
page size | 64 words |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 2.5 mm |
Maximum standby current | 0.00002 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
switch bit | YES |
width | 8.4 mm |
Maximum write cycle time (tWC) | 10 ms |
Base Number Matches | 1 |
HN58C256AFPI-85 | HN58C256ATI-10 | HN58C256AFPI-10 | HN58C256ATI-85 | |
---|---|---|---|---|
Description | EEPROM, 32KX8, 85ns, Parallel, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOP-28 | EEPROM, 32KX8, 100ns, Parallel, CMOS, PDSO28, PLASTIC, TSOP-28 | EEPROM, 32KX8, 100ns, Parallel, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOP-28 | EEPROM, 32KX8, 85ns, Parallel, CMOS, PDSO28, PLASTIC, TSOP-28 |
Maker | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
Parts packaging code | SOIC | TSOP | SOIC | TSOP |
package instruction | SOP, SOP28,.4 | TSOP1, TSSOP28,.53,22 | SOP, SOP28,.4 | TSOP1, TSSOP28,.53,22 |
Contacts | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 85 ns | 100 ns | 100 ns | 85 ns |
command user interface | NO | NO | NO | NO |
Data polling | YES | YES | YES | YES |
Durability | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
length | 18.3 mm | 11.8 mm | 18.3 mm | 11.8 mm |
memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 |
word count | 32768 words | 32768 words | 32768 words | 32768 words |
character code | 32000 | 32000 | 32000 | 32000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | TSOP1 | SOP | TSOP1 |
Encapsulate equivalent code | SOP28,.4 | TSSOP28,.53,22 | SOP28,.4 | TSSOP28,.53,22 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
page size | 64 words | 64 words | 64 words | 64 words |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V |
Programming voltage | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 2.5 mm | 1.2 mm | 2.5 mm | 1.2 mm |
Maximum standby current | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A |
Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 0.55 mm | 1.27 mm | 0.55 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
switch bit | YES | YES | YES | YES |
width | 8.4 mm | 8 mm | 8.4 mm | 8 mm |
Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms |
Base Number Matches | 1 | 1 | 1 | 1 |
Is it Rohs certified? | incompatible | incompatible | - | incompatible |
JESD-609 code | e0 | e0 | - | e0 |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |