Flash, 1MX16, 100ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Parts packaging code | BGA |
package instruction | TFBGA, BGA48,6X8,32 |
Contacts | 48 |
Reach Compliance Code | compliant |
ECCN code | 3A001.A.2.C |
Maximum access time | 100 ns |
Spare memory width | 8 |
startup block | BOTTOM |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B48 |
JESD-609 code | e1 |
length | 8.15 mm |
memory density | 16777216 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of departments/size | 8,31 |
Number of terminals | 48 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 1MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA48,6X8,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 2 V |
Programming voltage | 1.8 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.2 mm |
Department size | 8K,64K |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.025 mA |
Maximum supply voltage (Vsup) | 2.2 V |
Minimum supply voltage (Vsup) | 1.8 V |
Nominal supply voltage (Vsup) | 2 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
switch bit | YES |
type | NOR TYPE |
width | 6.15 mm |
Base Number Matches | 1 |