Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14,
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Fairchild |
Reach Compliance Code | compliant |
Counting direction | UP |
JESD-30 code | R-XDIP-T14 |
JESD-609 code | e0 |
Load/preset input | NO |
Logic integrated circuit type | BINARY COUNTER |
Operating mode | ASYNCHRONOUS |
Humidity sensitivity level | 2A |
Number of functions | 1 |
Number of terminals | 14 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | 250 |
power supply | 5/15 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
Base Number Matches | 1 |
4024BDCQR | 4024BDC | 4024BDCQM | 4024BDM | 5962-01-159-3567 | |
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Description | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14, | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14, | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14, | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14, | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14, |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
Counting direction | UP | UP | UP | UP | UP |
JESD-30 code | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
Load/preset input | NO | NO | NO | NO | YES |
Logic integrated circuit type | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Humidity sensitivity level | 2A | 2A | 2A | 2A | 2A |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | 250 | 250 |
power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
surface mount | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
Maker | Fairchild | Fairchild | Fairchild | Fairchild | - |
JESD-609 code | e0 | e0 | e0 | e0 | - |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |