Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, PDSO5, MO-178-AA, SOT-23, 5 PIN
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | SOIC |
package instruction | LSSOP, TSOP5/6,.11,37 |
Contacts | 5 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Factory Lead Time | 1 week |
Adjustable threshold | NO |
Analog Integrated Circuits - Other Types | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 code | R-PDSO-G5 |
JESD-609 code | e3 |
length | 2.9 mm |
Humidity sensitivity level | 1 |
Number of channels | 1 |
Number of functions | 1 |
Number of terminals | 5 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | LSSOP |
Encapsulate equivalent code | TSOP5/6,.11,37 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 2.7/28 V |
Certification status | Not Qualified |
Maximum seat height | 1.45 mm |
Maximum supply current (Isup) | 0.06 mA |
Maximum supply voltage (Vsup) | 28 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 12 V |
surface mount | YES |
technology | BICMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 0.95 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 1.625 mm |
Base Number Matches | 1 |
MAX4372FEUK+ | MAX4372HEUK+ | MAX4372TEBT+ | MAX4372HEUK | MAX4372HEBT | MAX4372FEBT+ | |
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Description | Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, PDSO5, MO-178-AA, SOT-23, 5 PIN | Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, PDSO5, ROHS COMPLIANT, MO-178AA, SOT-23, 5 PIN | Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, PBGA6, 1 X 1.50 MM, UCSP-6 | Power Management Circuit, BICMOS, PDSO5 | Power Management Circuit, BICMOS, PBGA6 | Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, PBGA6, 1 X 1.50 MM, ROHS COMPLIANT, UCSP-6 |
Is it Rohs certified? | conform to | conform to | conform to | incompatible | incompatible | conform to |
Reach Compliance Code | compliant | compliant | compliant | not_compliant | not_compliant | compliant |
JESD-30 code | R-PDSO-G5 | R-PDSO-G5 | R-PBGA-B6 | R-PDSO-G5 | R-PBGA-B6 | R-PBGA-B6 |
Number of terminals | 5 | 5 | 6 | 5 | 6 | 6 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LSSOP | LSSOP | VFBGA | TSOP | FBGA | VFBGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
surface mount | YES | YES | YES | YES | YES | YES |
technology | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | GULL WING | GULL WING | BALL | GULL WING | BALL | BALL |
Terminal pitch | 0.95 mm | 0.95 mm | 0.5 mm | 0.95 mm | 0.5 mm | 0.5 mm |
Terminal location | DUAL | DUAL | BOTTOM | DUAL | BOTTOM | BOTTOM |
Is it lead-free? | Lead free | - | Lead free | Contains lead | Contains lead | - |
Parts packaging code | SOIC | - | BGA | SOT-23 | SOT-23 | - |
package instruction | LSSOP, TSOP5/6,.11,37 | LSSOP, | VFBGA, BGA6,2X3,20 | - | - | VFBGA, |
Contacts | 5 | - | 6 | 5 | 5 | - |
ECCN code | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
Factory Lead Time | 1 week | - | 12 weeks | 1 week | - | 12 weeks |
Adjustable threshold | NO | NO | NO | - | - | NO |
Analog Integrated Circuits - Other Types | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | - | POWER SUPPLY SUPPORT CIRCUIT |
JESD-609 code | e3 | e3 | - | e0 | e0 | - |
length | 2.9 mm | 2.9 mm | 1.52 mm | - | - | 1.52 mm |
Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | - |
Number of channels | 1 | 1 | 1 | - | - | 1 |
Number of functions | 1 | 1 | 1 | - | - | 1 |
Encapsulate equivalent code | TSOP5/6,.11,37 | - | BGA6,2X3,20 | TSOP5/6,.11,37 | BGA6,2X3,20 | - |
power supply | 2.7/28 V | - | 2.7/28 V | 2.7/28 V | 2.7/28 V | - |
Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
Maximum seat height | 1.45 mm | 1.45 mm | 0.67 mm | - | - | 0.67 mm |
Maximum supply current (Isup) | 0.06 mA | - | 0.06 mA | 0.06 mA | 0.06 mA | - |
Maximum supply voltage (Vsup) | 28 V | 28 V | 28 V | - | - | 28 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | - | - | 2.7 V |
Nominal supply voltage (Vsup) | 12 V | 12 V | 12 V | - | - | 12 V |
Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn63Pb37) | - |
width | 1.625 mm | 1.625 mm | 1 mm | - | - | 1 mm |