IC,BUFFER/DRIVER,SINGLE,10-BIT,BICMOS-TTL,DIP,24PIN,CERAMIC
| Parameter Name | Attribute value |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| Control type | ENABLE LOW |
| JESD-30 code | R-XDIP-T24 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | BUS DRIVER |
| MaximumI(ol) | 0.015 A |
| Number of digits | 10 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | INVERTED |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| method of packing | TAPE AND REEL |
| power supply | 5 V |
| Maximum supply current (ICC) | 38 mA |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 54BCT2828ADCX | 54BCT2828ADC | 74BCT2828APC | 74BCT2828ASC | 74BCT2828ASCX | |
|---|---|---|---|---|---|
| Description | IC,BUFFER/DRIVER,SINGLE,10-BIT,BICMOS-TTL,DIP,24PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,10-BIT,BICMOS-TTL,DIP,24PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,10-BIT,BICMOS-TTL,DIP,24PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,10-BIT,BICMOS-TTL,SOP,24PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,10-BIT,BICMOS-TTL,SOP,24PIN,PLASTIC |
| package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.6 | SOP, SOP24,.4 | SOP, SOP24,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| MaximumI(ol) | 0.015 A | 0.015 A | 0.015 A | 0.015 A | 0.015 A |
| Number of digits | 10 | 10 | 10 | 10 | 10 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | SOP | SOP |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | DIP24,.6 | SOP24,.4 | SOP24,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 38 mA | 38 mA | 38 mA | 38 mA | 38 mA |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | YES | YES |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | - | - |
| Is it Rohs certified? | - | - | incompatible | incompatible | incompatible |
| JESD-609 code | - | - | e0 | e0 | e0 |
| Prop。Delay @ Nom-Sup | - | - | 8.5 ns | 8.5 ns | 8.5 ns |
| Terminal surface | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
PCB Design
Automotive Electronics
RF/Wirelessly
RF/Wirelessly
GD32 MCU
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