EDO DRAM Module, 32MX36, 50ns, CMOS, PSMA72
Parameter Name | Attribute value |
Maker | SAMSUNG |
package instruction | SIMM, SSIM72 |
Reach Compliance Code | unknown |
Maximum access time | 50 ns |
I/O type | COMMON |
JESD-30 code | R-PSMA-N72 |
memory density | 1207959552 bit |
Memory IC Type | EDO DRAM MODULE |
memory width | 36 |
Number of terminals | 72 |
word count | 33554432 words |
character code | 32000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32MX36 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SIMM |
Encapsulate equivalent code | SSIM72 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 4096 |
Maximum standby current | 0.024 A |
Maximum slew rate | 1.584 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | SINGLE |
Base Number Matches | 1 |
KMM53632004AKG-5 | KMM53632004AK-6 | KMM53632004AKG-6 | |
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Description | EDO DRAM Module, 32MX36, 50ns, CMOS, PSMA72 | EDO DRAM Module, 32MX36, 60ns, CMOS, PSMA72 | EDO DRAM Module, 32MX36, 60ns, CMOS, PSMA72 |
Maker | SAMSUNG | SAMSUNG | SAMSUNG |
package instruction | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 |
Reach Compliance Code | unknown | unknown | unknown |
Maximum access time | 50 ns | 60 ns | 60 ns |
I/O type | COMMON | COMMON | COMMON |
JESD-30 code | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 |
memory density | 1207959552 bit | 1207959552 bit | 1207959552 bit |
Memory IC Type | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
memory width | 36 | 36 | 36 |
Number of terminals | 72 | 72 | 72 |
word count | 33554432 words | 33554432 words | 33554432 words |
character code | 32000000 | 32000000 | 32000000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 32MX36 | 32MX36 | 32MX36 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SIMM | SIMM | SIMM |
Encapsulate equivalent code | SSIM72 | SSIM72 | SSIM72 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
power supply | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 4096 | 4096 | 4096 |
Maximum standby current | 0.024 A | 0.024 A | 0.024 A |
Maximum slew rate | 1.584 mA | 1.464 mA | 1.464 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | SINGLE | SINGLE | SINGLE |
ECCN code | - | EAR99 | EAR99 |