Loadable PLD, 1.73ns, CMOS, PBGA356, BGA-356
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Intel |
package instruction | BGA-356 |
Reach Compliance Code | compliant |
ECCN code | 3A991 |
JESD-30 code | S-PBGA-B356 |
JESD-609 code | e0 |
length | 35 mm |
Humidity sensitivity level | 3 |
Dedicated input times | 4 |
Number of I/O lines | 246 |
Number of entries | 238 |
Number of logical units | 4160 |
Output times | 238 |
Number of terminals | 356 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 4 DEDICATED INPUTS, 246 I/O |
Output function | MACROCELL |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Encapsulate equivalent code | BGA356,26X26,50 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 220 |
power supply | 1.8,1.8/3.3 V |
Programmable logic type | LOADABLE PLD |
propagation delay | 1.73 ns |
Certification status | Not Qualified |
Maximum seat height | 1.63 mm |
Maximum supply voltage | 1.89 V |
Minimum supply voltage | 1.71 V |
Nominal supply voltage | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 35 mm |
Base Number Matches | 1 |