|
74LVC574APW |
74LVC574AD |
74LVC574ADB |
74LVC574ADB-T |
Description |
Flip Flops 3.3V OCTAL D FF POS EDGE 3-S |
Flip Flops 3.3V OCTAL D FF POS EDGE 3-S |
Flip Flops 3.3V OCTAL D FF POS EDGE 3-S |
Flip Flops 3.3V OCTAL D FF POS EDGE 3-S |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Maker |
NXP |
NXP |
NXP |
NXP |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
Other features |
BROADSIDE VERSION OF 374 |
BROADSIDE VERSION OF 374 |
BROADSIDE VERSION OF 374 |
BROADSIDE VERSION OF 374 |
series |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
JESD-30 code |
R-PDSO-G20 |
R-PDSO-G20 |
R-PDSO-G20 |
R-PDSO-G20 |
length |
6.5 mm |
12.8 mm |
7.2 mm |
7.2 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
Number of digits |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
Number of ports |
2 |
2 |
2 |
2 |
Number of terminals |
20 |
20 |
20 |
20 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
SOP |
SSOP |
SSOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
propagation delay (tpd) |
10 ns |
10 ns |
10 ns |
10 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.1 mm |
2.65 mm |
2 mm |
2 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
Nominal supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
NICKEL PALLADIUM GOLD |
NICKEL PALLADIUM GOLD |
NICKEL PALLADIUM GOLD |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
1.27 mm |
0.65 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
30 |
30 |
width |
4.4 mm |
7.5 mm |
5.3 mm |
5.3 mm |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
- |
Parts packaging code |
TSSOP |
SOIC |
SSOP |
- |
package instruction |
4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 |
7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20 |
5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20 |
- |
Contacts |
20 |
20 |
20 |
- |
Maximum Frequency@Nom-Sup |
100000000 Hz |
100000000 Hz |
100000000 Hz |
- |
MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
- |
Encapsulate equivalent code |
TSSOP20,.25 |
SOP20,.4 |
SSOP20,.3 |
- |
method of packing |
TUBE |
TUBE |
TUBE |
- |
power supply |
3.3 V |
3.3 V |
3.3 V |
- |
Prop。Delay @ Nom-Sup |
9 ns |
9 ns |
9 ns |
- |
Trigger type |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
- |
JESD-609 code |
- |
e4 |
e4 |
e4 |