Flash Memory 256K x 8 (2M bit)
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Atmel (Microchip) |
| Parts packaging code | QFJ |
| package instruction | PLASTIC, MS-016AE, LCC-32 |
| Contacts | 32 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 120 ns |
| Other features | HARDWARE DATA PROTECTION |
| startup block | TOP |
| command user interface | YES |
| Data polling | YES |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 2097152 bit |
| Memory IC Type | FLASH |
| memory width | 8 |
| Humidity sensitivity level | 2 |
| Number of functions | 1 |
| Number of departments/size | 1,2,1,1 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Programming voltage | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.55 mm |
| Department size | 16K,8K,96K,128K |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.09 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| switch bit | YES |
| type | NOR TYPE |
| width | 11.43 mm |
| AT49F002NT-12JC | AT49F002T-12JI | AT49F002N-90JC | AT49F002-70TC | AT49F002N-55JI | |
|---|---|---|---|---|---|
| Description | Flash Memory 256K x 8 (2M bit) | Flash Memory 256K x 8 (2M bit) | Flash Memory 256K x 8 (2M bit) | NOR Flash | NOR Flash 256K x 8 (2M bit) |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| Parts packaging code | QFJ | QFJ | QFJ | TSOP | QFJ |
| package instruction | PLASTIC, MS-016AE, LCC-32 | PLASTIC, MS-016AE, LCC-32 | PLASTIC, MS-016AE, LCC-32 | TSOP1, TSSOP32,.8,20 | QCCJ, LDCC32,.5X.6 |
| Contacts | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 120 ns | 120 ns | 90 ns | 70 ns | 55 ns |
| startup block | TOP | TOP | BOTTOM | BOTTOM | BOTTOM |
| command user interface | YES | YES | YES | YES | YES |
| Data polling | YES | YES | YES | YES | YES |
| JESD-30 code | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PDSO-G32 | R-PQCC-J32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| length | 13.97 mm | 13.97 mm | 13.97 mm | 18.4 mm | 13.97 mm |
| memory density | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| Memory IC Type | FLASH | FLASH | FLASH | FLASH | FLASH |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Humidity sensitivity level | 2 | 2 | 2 | 3 | 2 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of departments/size | 1,2,1,1 | 1,2,1,1 | 1,2,1,1 | 1,2,1,1 | 1,2,1,1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCJ | QCCJ | TSOP1 | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | TSSOP32,.8,20 | LDCC32,.5X.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 240 | 225 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.55 mm | 3.55 mm | 3.55 mm | 1.2 mm | 3.55 mm |
| Department size | 16K,8K,96K,128K | 16K,8K,96K,128K | 16K,8K,96K,128K | 16K,8K,96K,128K | 16K,8K,96K,128K |
| Maximum standby current | 0.0001 A | 0.0003 A | 0.0001 A | 0.0001 A | 0.0003 A |
| Maximum slew rate | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | J BEND | GULL WING | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | DUAL | QUAD |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 |
| switch bit | YES | YES | YES | YES | YES |
| type | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| width | 11.43 mm | 11.43 mm | 11.43 mm | 8 mm | 11.43 mm |
| Other features | HARDWARE DATA PROTECTION | HARDWARE DATA PROTECTION | HARDWARE DATA PROTECTION | HARDWARE DATA PROTECTION | - |
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