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TS27L2BID

Description
Operational Amplifiers - Op Amps Dual Prec Low-Power
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size202KB,9 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance
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TS27L2BID Overview

Operational Amplifiers - Op Amps Dual Prec Low-Power

TS27L2BID Parametric

Parameter NameAttribute value
Brand NameSTMicroelectronics
Is it Rohs certified?conform to
MakerSTMicroelectronics
Parts packaging codeSOIC
package instructionSOP, SOP8,.25
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Maximum average bias current (IIB)0.0003 µA
Nominal Common Mode Rejection Ratio80 dB
frequency compensationYES
Maximum input offset voltage3500 µV
JESD-30 codeR-PDSO-G8
JESD-609 codee4
length4.9 mm
low-biasYES
low-dissonanceNO
micropowerYES
Humidity sensitivity level1
Negative supply voltage upper limit
Nominal Negative Supply Voltage (Vsup)
Number of functions2
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
powerNO
power supply5/10 V
Programmable powerNO
Certification statusNot Qualified
Maximum seat height1.75 mm
Nominal slew rate0.04 V/us
Maximum slew rate0.036 mA
Supply voltage upper limit18 V
Nominal supply voltage (Vsup)10 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
Nominal Uniform Gain Bandwidth100 kHz
Minimum voltage gain40000
broadbandNO
width3.9 mm
TS27L2C,I,M
PRECISION VERY LOW POWER
CMOS DUAL OPERATIONAL AMPLIFIERS
s
VERY LOW POWER CONSUMPTION :
10µA/op
s
OUTPUT VOLTAGE CAN SWING TO
GROUND
s
EXCELLENT PHASE MARGIN ON
CAPACITIVE LOADS
s
STABLE AND LOW OFFSET VOLTAGE
s
THREE INPUT OFFSET VOLTAGE
SELECTIONS
DESCRIPTION
These devices are low cost, low power dual oper-
ational amplifiers designed to operate with single
or dual supplies. These operational amplifiers use
the ST silicon gate CMOS process allowing an ex-
cellent consumption-speed ratio. These series are
ideally suited for low consumption applications.
Three power consumptions are available allowing
to have always the best consumption-speed ratio:
N
DIP8
(Plastic Package)
D
SO8
(Plastic Micropackage)
P
TSSOP8
(Thin Shrink Small Outline Package)
u
I
CC
= 10µA/amp.: TS27L2 (very low power)
u
I
CC
= 150µA/amp.: TS27M2 (low power)
u
I
CC
= 1mA/amp.: TS272 (standard)
These CMOS amplifiers offer very high input im-
pedance and extremely low input currents. The
major advantage versus JFET devices is the very
low input currents drift with temperature (see fig-
ure 2).
ORDER CODE
Package
Part Number
Temperature Range
N
TS27L2C/AC/BC
0°C, +70°C
TS27L2I/AI/BI
-40°C, +125°C
TS27L2M/AM/BM
-55°C, +125°C
Example :
TS27L2ACN
D
P
PIN CONNECTIONS
(top view)
1
2
3
4
-
+
-
+
8
7
6
5
N =
Dual in Line Package (DIP)
D =
Small Outline Package (SO) - also available in Tape & Reel (DT)
P =
Thin Shrink Small Outline Package (TSSOP) - only available
in Tape & Reel (PT)
1 - Output 1
2 - Inverting Input 1
3 - Non-inverting Input 1
4 - V
CC
-
5 - Non-inverting Input 2
6 - Inverting Input 2
7 - Output 2
8 - V
CC
+
November 2001
1/9

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Description Operational Amplifiers - Op Amps Dual Prec Low-Power Operational Amplifiers - Op Amps Dual Prec Low-Power LDO Voltage Regulators 300mA Low Quiescent Crnt low noise LDO Operational Amplifiers - Op Amps Dual Prec Low-Power PCBs u0026 Breadboards SOIC to DIP adpt 0.7in DIP spacing Operational Amplifiers - Op Amps Dual Prec Low-Power Operational Amplifiers - Op Amps Dual Prec Low-Power Precision Amplifiers PRCISION VERY Lo Pwr CMOS DUAL OP AMPS Operational Amplifiers - Op Amps Dual Prec Low-Power
Brand Name STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code SOIC SOIC SOIC DIP SOIC SOIC SOIC SOIC SOIC DIP
package instruction SOP, SOP8,.25 SOP, SOP8,.25 TSSOP, TSSOP8,.25 DIP, DIP8,.3 SOP, SOP8,.25 SOP, SOP8,.25 TSSOP, TSSOP8,.25 SOP, SOP8,.25 SOP, SOP8,.25 DIP, DIP8,.3
Contacts 8 8 8 8 8 8 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Maximum average bias current (IIB) 0.0003 µA 0.0003 µA 0.0003 µA 0.00015 µA 0.00015 µA 0.0003 µA 0.0003 µA 0.0003 µA 0.00015 µA 0.00015 µA
Nominal Common Mode Rejection Ratio 80 dB 80 dB 80 dB 80 dB 80 dB 80 dB 80 dB 80 dB 80 dB 80 dB
frequency compensation YES YES YES YES YES YES YES YES YES YES
Maximum input offset voltage 3500 µV 6500 µV 12000 µV 6500 µV 6500 µV 6500 µV 3500 µV 12000 µV 3000 µV 12000 µV
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8
JESD-609 code e4 e4 e4 e3 e4 e4 e4 e4 e4 e3
low-bias YES YES YES YES YES YES YES YES YES YES
low-dissonance NO NO NO NO NO NO NO NO NO NO
micropower YES YES YES YES YES YES YES YES YES YES
Number of functions 2 2 2 2 2 2 2 2 2 2
Number of terminals 8 8 8 8 8 8 8 8 8 8
Maximum operating temperature 125 °C 125 °C 125 °C 70 °C 70 °C 125 °C 125 °C 125 °C 70 °C 70 °C
Minimum operating temperature -40 °C -40 °C -40 °C - - -40 °C -40 °C -40 °C - -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP TSSOP DIP SOP SOP TSSOP SOP SOP DIP
Encapsulate equivalent code SOP8,.25 SOP8,.25 TSSOP8,.25 DIP8,.3 SOP8,.25 SOP8,.25 TSSOP8,.25 SOP8,.25 SOP8,.25 DIP8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Celsius) 260 260 260 NOT SPECIFIED 260 260 260 260 260 NOT SPECIFIED
power NO NO NO NO NO NO NO NO NO NO
power supply 5/10 V 5/10 V 5/10 V 5/10 V 5/10 V 5/10 V 5/10 V 5/10 V 5/10 V 5/10 V
Programmable power NO NO NO NO NO NO NO NO NO NO
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 1.75 mm 1.2 mm 5.08 mm 1.75 mm 1.75 mm 1.2 mm 1.75 mm 1.75 mm 5.08 mm
Nominal slew rate 0.04 V/us 0.04 V/us 0.04 V/us 0.04 V/us 0.04 V/us 0.04 V/us 0.04 V/us 0.04 V/us 0.04 V/us 0.04 V/us
Maximum slew rate 0.036 mA 0.036 mA 0.036 mA 0.034 mA 0.034 mA 0.036 mA 0.036 mA 0.036 mA 0.034 mA 0.034 mA
Supply voltage upper limit 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V
Nominal supply voltage (Vsup) 10 V 10 V 10 V 10 V 10 V 10 V 10 V 10 V 10 V 10 V
surface mount YES YES YES NO YES YES YES YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE COMMERCIAL COMMERCIAL AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE COMMERCIAL COMMERCIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) - annealed
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 0.65 mm 2.54 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 10 NOT SPECIFIED 30 30 10 30 30 NOT SPECIFIED
Nominal Uniform Gain Bandwidth 100 kHz 100 kHz 100 kHz 100 kHz 100 kHz 100 kHz 100 kHz 100 kHz 100 kHz 100 kHz
Minimum voltage gain 40000 40000 40000 45000 45000 40000 40000 40000 45000 45000
broadband NO NO NO NO NO NO NO NO NO NO
width 3.9 mm 3.9 mm 3 mm 7.62 mm 3.9 mm 3.9 mm 3 mm 3.9 mm 3.9 mm 7.62 mm
Is it Rohs certified? conform to conform to - conform to - conform to conform to conform to conform to conform to
Maker STMicroelectronics - STMicroelectronics STMicroelectronics STMicroelectronics - STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
length 4.9 mm 4.9 mm 4.4 mm - 4.9 mm 4.9 mm 4.4 mm 4.9 mm 4.9 mm -
Humidity sensitivity level 1 1 1 - 1 1 1 1 1 -
Factory Lead Time - 25 weeks 12 weeks - 10 weeks 10 weeks - 10 weeks - 43 weeks 2 days
method of packing - - TAPE AND REEL - TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL -

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