Zener Diodes
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Microsemi |
| Contacts | 2 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Diode component materials | SILICON |
| Diode type | ZENER DIODE |
| JESD-30 code | O-LALF-W2 |
| JESD-609 code | e0 |
| Number of components | 1 |
| Number of terminals | 2 |
| Package body material | GLASS |
| Package shape | ROUND |
| Package form | LONG FORM |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| polarity | UNIDIRECTIONAL |
| Maximum power dissipation | 1 W |
| Certification status | Not Qualified |
| Nominal reference voltage | 200 V |
| surface mount | NO |
| technology | ZENER |
| Terminal surface | TIN LEAD |
| Terminal form | WIRE |
| Terminal location | AXIAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Maximum voltage tolerance | 5% |
| Working test current | 1.2 mA |
| UZ8120 | UZ8840 | UZ8713 | UZ8809 | UZ8812 | |
|---|---|---|---|---|---|
| Description | Zener Diodes | Zener Diodes | Zener Diodes | Zener Diodes | Zener Diodes |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Contacts | 2 | 2 | 2 | 2 | 2 |
| Reach Compliance Code | unknown | compliant | unknown | unknown | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Shell connection | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Diode component materials | SILICON | SILICON | SILICON | SILICON | SILICON |
| Diode type | ZENER DIODE | ZENER DIODE | ZENER DIODE | ZENER DIODE | ZENER DIODE |
| JESD-30 code | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
| Number of components | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | 2 | 2 | 2 |
| Package body material | GLASS | GLASS | GLASS | GLASS | GLASS |
| Package shape | ROUND | ROUND | ROUND | ROUND | ROUND |
| Package form | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
| polarity | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL |
| Maximum power dissipation | 1 W | 1 W | 1 W | 1 W | 1 W |
| Nominal reference voltage | 200 V | 40 V | 13 V | 9.1 V | 12 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | ZENER | ZENER | ZENER | ZENER | ZENER |
| Terminal form | WIRE | WIRE | WIRE | WIRE | WIRE |
| Terminal location | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL |
| Maximum voltage tolerance | 5% | 10% | 5% | 10% | 10% |
| Working test current | 1.2 mA | 6.5 mA | 21 mA | 28 mA | 23 mA |
| Maker | Microsemi | - | Microsemi | Microsemi | - |
| JESD-609 code | e0 | e0 | e0 | - | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | - |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | - | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| package instruction | - | O-LALF-W2 | - | HERMETIC SEALED, GLASS PACKAGE-2 | O-LALF-W2 |
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