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MCM32200SG10

Description
2M x 32 Bit Dynamic Random Access Memory Module
Categorystorage    storage   
File Size549KB,13 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MCM32200SG10 Overview

2M x 32 Bit Dynamic Random Access Memory Module

MCM32200SG10 Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeSIMM
package instructionSIMM, SSIM72
Contacts72
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFAST PAGE
Maximum access time100 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Spare memory width16
I/O typeCOMMON
JESD-30 codeR-XSMA-N72
memory density67108864 bi
Memory IC TypeFAST PAGE DRAM MODULE
memory width32
Number of functions1
Number of ports1
Number of terminals72
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX32
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeSIMM
Encapsulate equivalent codeSSIM72
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply5 V
Certification statusNot Qualified
refresh cycle1024
Maximum seat height31.75 mm
self refreshNO
Maximum standby current0.016 A
Maximum slew rate0.736 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationSINGLE

MCM32200SG10 Related Products

MCM32200SG10 MCM32L200 MCM32200SG80 MCM32200
Description 2M x 32 Bit Dynamic Random Access Memory Module 2M x 32 Bit Dynamic Random Access Memory Module 2M x 32 Bit Dynamic Random Access Memory Module 2M x 32 Bit Dynamic Random Access Memory Module

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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