LFE2M35E-5F256I datasheet, PDF

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LFE2M35E-5F256I: DescriptionFPGA - Field Programmable Gate Array 34K LUTs SERDES MEM DSP 1.2V -5 Spd I; CategoryProgrammable logic devices Programmable logic; File Size16MB，771 Pages; ManufacturerLattice; Websitehttp://www.latticesemi.com

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LFE2M35E-5F256I Overview

FPGA - Field Programmable Gate Array 34K LUTs SERDES MEM DSP 1.2V -5 Spd I

LFE2M35E-5F256I Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Lattice
Parts packaging code	BGA
package instruction	FPBGA-256
Contacts	256
Reach Compliance Code	compliant
ECCN code	EAR99
maximum clock frequency	311 MHz
Combined latency of CLB-Max	0.358 ns
JESD-30 code	S-PBGA-B256
JESD-609 code	e0
length	17 mm
Humidity sensitivity level	3
Number of entries	140
Number of logical units	35000
Output times	140
Number of terminals	256
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA256,16X16,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
power supply	1.2 V
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
Maximum seat height	2.1 mm
Maximum supply voltage	1.26 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	17 mm

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LatticeECP2/M Family Handbook

HB1003 Version 05.3, February 2012

LatticeECP2/M Family Handbook

Table of Contents

February 2012

Section I. LatticeECP2/M Family Data Sheet

Introduction

Features ............................................................................................................................................................. 1-1

Introduction ........................................................................................................................................................ 1-2

Architecture

Architecture Overview ........................................................................................................................................ 2-1

PFU Blocks ........................................................................................................................................................ 2-3

Slice .......................................................................................................................................................... 2-3

Modes of Operation................................................................................................................................... 2-5

Routing............................................................................................................................................................... 2-6

sysCLOCK Phase Locked Loops (GPLL/SPLL) ................................................................................................ 2-6

General Purpose PLL (GPLL) ................................................................................................................... 2-6

Standard PLL (SPLL) ................................................................................................................................ 2-7

Delay Locked Loops (DLL)................................................................................................................................. 2-8

DLLDELA Delay Block .............................................................................................................................. 2-9

PLL/DLL Cascading .................................................................................................................................. 2-9

GPLL/SPLL/GDLL PIO Input Pin Connections (LatticeECP2M Family Only) .................................................. 2-10

Clock Dividers .................................................................................................................................................. 2-10

Clock Distribution Network ............................................................................................................................... 2-11

Primary Clock Sources............................................................................................................................ 2-11

Secondary Clock/Control Sources .......................................................................................................... 2-13

Edge Clock Sources................................................................................................................................ 2-14

Primary Clock Routing ............................................................................................................................ 2-15

Dynamic Clock Select (DCS) .................................................................................................................. 2-15

Secondary Clock/Control Routing ........................................................................................................... 2-15

Slice Clock Selection............................................................................................................................... 2-17

Edge Clock Routing ................................................................................................................................ 2-18

sysMEM Memory ............................................................................................................................................. 2-19

sysMEM Memory Block........................................................................................................................... 2-19

Bus Size Matching .................................................................................................................................. 2-19

RAM Initialization and ROM Operation ................................................................................................... 2-19

Memory Cascading ................................................................................................................................. 2-19

Single, Dual and Pseudo-Dual Port Modes............................................................................................. 2-19

Memory Core Reset ................................................................................................................................ 2-20

EBR Asynchronous Reset....................................................................................................................... 2-20

sysDSP™ Block ............................................................................................................................................... 2-21

sysDSP Block Approach Compared to General DSP ............................................................................. 2-21

sysDSP Block Capabilities ...................................................................................................................... 2-21

MULT sysDSP Element .......................................................................................................................... 2-23

MAC sysDSP Element ............................................................................................................................ 2-24

MULTADDSUB sysDSP Element ........................................................................................................... 2-25

MULTADDSUBSUM sysDSP Element ................................................................................................... 2-26

Clock, Clock Enable and Reset Resources ............................................................................................ 2-26

Signed and Unsigned with Different Widths............................................................................................ 2-27

OVERFLOW Flag from MAC .................................................................................................................. 2-27

IPexpress™............................................................................................................................................. 2-28

Optimized DSP Functions ................................................................................................................................ 2-28

Resources Available in the LatticeECP2/M Family ................................................................................. 2-28

or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

www.latticesemi.com

Lattice Semiconductor

Table of Contents

LatticeECP2/M Family Handbook

LatticeECP2/M DSP Performance .......................................................................................................... 2-29

Programmable I/O Cells (PIC) ......................................................................................................................... 2-29

PIO ................................................................................................................................................................... 2-31

Input Register Block ................................................................................................................................ 2-31

Output Register Block ............................................................................................................................. 2-33

Tristate Register Block ............................................................................................................................ 2-35

Control Logic Block ................................................................................................................................. 2-35

DDR Memory Support...................................................................................................................................... 2-35

Left and Right Edges............................................................................................................................... 2-35

Bottom Edge ........................................................................................................................................... 2-35

Top Edge................................................................................................................................................. 2-36

DLL Calibrated DQS Delay Block ........................................................................................................... 2-37

Polarity Control Logic .............................................................................................................................. 2-39

DQSXFER............................................................................................................................................... 2-40

sysI/O Buffer .................................................................................................................................................... 2-40

sysI/O Buffer Banks ................................................................................................................................ 2-40

Typical sysI/O I/O Behavior During Power-up......................................................................................... 2-43

Supported sysI/O Standards ................................................................................................................... 2-43

Hot Socketing.......................................................................................................................................... 2-45

SERDES and PCS (Physical Coding Sublayer)............................................................................................... 2-46

SERDES Block........................................................................................................................................ 2-46

PCS......................................................................................................................................................... 2-47

SCI (SERDES Client Interface) Bus........................................................................................................ 2-47

IEEE 1149.1-Compliant Boundary Scan Testability......................................................................................... 2-48

Device Configuration........................................................................................................................................ 2-48

Soft Error Detect (SED) Support ............................................................................................................. 2-48

External Resistor..................................................................................................................................... 2-49

On-Chip Oscillator................................................................................................................................... 2-49

Density Shifting ................................................................................................................................................ 2-49

DC and Switching Characteristics

Absolute Maximum Ratings

, ,

............................................................................................................................. 3-1

Recommended Operating Conditions ................................................................................................................ 3-1

Hot Socketing Specifications.............................................................................................................................. 3-2

ESD Performance .............................................................................................................................................. 3-2

DC Electrical Characteristics.............................................................................................................................. 3-3

LatticeECP2 Supply Current (Standby).............................................................................................................. 3-4

LatticeECP2M Supply Current (Standby)........................................................................................................... 3-5

LatticeECP2 Initialization Supply Current .......................................................................................................... 3-6

LatticeECP2M Initialization Supply Current ....................................................................................................... 3-7

SERDES Power Supply Requirements (LatticeECP2M Family Only) ............................................................... 3-8

SERDES Power (LatticeECP2M Family Only)................................................................................................... 3-8

sysI/O Recommended Operating Conditions..................................................................................................... 3-9

sysI/O Single-Ended DC Electrical Characteristics.......................................................................................... 3-10

sysI/O Differential Electrical Characteristics .................................................................................................... 3-11

LVDS....................................................................................................................................................... 3-11

Differential HSTL and SSTL.................................................................................................................... 3-11

LVDS25E ................................................................................................................................................ 3-12

LVCMOS33D .......................................................................................................................................... 3-12

BLVDS .................................................................................................................................................... 3-13

LVPECL .................................................................................................................................................. 3-14

RSDS ...................................................................................................................................................... 3-15

MLVDS.................................................................................................................................................... 3-16

Typical Building Block Function Performance.................................................................................................. 3-17

Pin-to-Pin Performance (LVCMOS25 12mA Drive) ................................................................................ 3-17

Lattice Semiconductor

Table of Contents

LatticeECP2/M Family Handbook

Register-to-Register Performance .......................................................................................................... 3-17

Derating Timing Tables .................................................................................................................................... 3-18

LatticeECP2/M External Switching Characteristics.......................................................................................... 3-19

LatticeECP2/M Internal Switching Characteristics ........................................................................................... 3-28

Timing Diagrams .............................................................................................................................................. 3-30

LatticeECP2/M Family Timing Adders ............................................................................................................. 3-32

sysCLOCK GPLL Timing ................................................................................................................................. 3-35

sysCLOCK SPLL Timing.................................................................................................................................. 3-36

DLL Timing....................................................................................................................................................... 3-37

SERDES High-Speed Data Transmitter (LatticeECP2M Family Only) ............................................................ 3-38

SERDES High Speed Data Receiver (LatticeECP2M Family Only) ................................................................ 3-41

Input Data Jitter Tolerance...................................................................................................................... 3-41

SERDES External Reference Clock (LatticeECP2M Family Only) ......................................................... 3-43

SERDES Power-Down/Power-Up Specification .............................................................................................. 3-43

PCI Express Electrical and Timing Characteristics .......................................................................................... 3-44

AC and DC Characteristics ..................................................................................................................... 3-44

LatticeECP2/M sysCONFIG Port Timing Specifications .................................................................................. 3-46

JTAG Port Timing Specifications ..................................................................................................................... 3-50

Switching Test Conditions................................................................................................................................ 3-51

Pinout Information

Signal Descriptions ............................................................................................................................................ 4-1

PICs and DDR Data (DQ) Pins Associated with the DDR Strobe (DQS) Pin .................................................... 4-4

LatticeECP2 Pin Information Summary, LFE2-6 and LFE2-12 .......................................................................... 4-5

LatticeECP2 Pin Information Summary, LFE2-20 and LFE2-35 ........................................................................ 4-7

LatticeECP2 Pin Information Summary, LFE2-50 and LFE2-70 ........................................................................ 4-9

LatticeECP2M Pin Information Summary, LFE2M20 and LFE2M35 ............................................................... 4-11

LatticeECP2M Pin Information Summary, LFE2M50, LFE2M70 and LFE2M100............................................ 4-13

Available Device Resources by Package, LatticeECP2................................................................................... 4-15

Available Device Resources by Package, LatticeECP2M................................................................................ 4-15

LatticeECP2 Power Supply and NC................................................................................................................. 4-16

LatticeECP2 Power Supply and NC (Cont.)..................................................................................................... 4-17

LatticeECP2M Power Supply and NC.............................................................................................................. 4-18

LatticeECP2M Power Supply and NC (Cont.).................................................................................................. 4-19

LatticeECP2M Power Supply and NC (Cont.).................................................................................................. 4-21

LFE2-6E/SE and LFE2-12E/SE Logic Signal Connections: 144 TQFP ........................................................... 4-22

LFE2-12E/SE and LFE2-20E/SE Logic Signal Connections: 208 PQFP......................................................... 4-26

LFE2-6E/SE and LFE2-12E/SE Logic Signal Connections: 256 fpBGA .......................................................... 4-31

LFE2-20E/SE Logic Signal Connections: 256 fpBGA ...................................................................................... 4-39

LFE2-12E/SE and LFE2-20E/SE Logic Signal Connections: 484 fpBGA ........................................................ 4-47

LFE2-35E/SE and LFE2-50E/SE Logic Signal Connections: 484 fpBGA ........................................................ 4-60

LFE2-20E/SE and LFE2-35E/SE Logic Signal Connections: 672 fpBGA ........................................................ 4-73

LFE2-50E/SE and LFE2-70E/SE Logic Signal Connections: 672 fpBGA ........................................................ 4-91

LFE2-70E/SE Logic Signal Connections: 900 fpBGA .................................................................................... 4-109

LFE2M-20E/SE and LFE2M-35E/SE Logic Signal Connections: 256 fpBGA ................................................ 4-134

LFE2M20E/SE and LFE2M35E/SE Logic Signal Connections: 484 fpBGA .................................................. 4-141

LFE2M50E/SE Logic Signal Connections: 484 fpBGA .................................................................................. 4-153

LFE2M35E/SE and LFE2M50E/SE Logic Signal Connections: 672 fpBGA .................................................. 4-167

LFE2M50E/SE and LFE2M70E/SE Logic Signal Connections: 900 fpBGA .................................................. 4-184

LFE2M100E/SE Logic Signal Connections: 900 fpBGA ................................................................................ 4-206

LFE2M70E/SE and LFE2M100E/SE Logic Signal Connections: 1152 fpBGA .............................................. 4-231

Ordering Information

LatticeECP2 Part Number Description............................................................................................................... 5-1

Ordering Information .......................................................................................................................................... 5-1

LatticeECP2 Standard Series Devices, Conventional Packaging............................................................. 5-2

Lattice Semiconductor

Table of Contents

LatticeECP2/M Family Handbook

LatticeECP2 Standard Series Devices, Lead-Free Packaging .......................................................................... 5-5

LatticeECP2 S-Series Devices, Conventional Packaging......................................................................... 5-8

LatticeECP2 S-Series Devices, Lead-Free Packaging ........................................................................... 5-11

LatticeECP2M Part Number Description.......................................................................................................... 5-14

Ordering Information ........................................................................................................................................ 5-14

LatticeECP2M Standard Series Devices, Conventional Packaging........................................................ 5-15

LatticeECP2M Standard Series Devices, Lead-Free Packaging ............................................................ 5-18

LatticeECP2M S-Series Devices, Lead-Free Packaging ........................................................................ 5-23

Supplemental Information

For Further Information ...................................................................................................................................... 6-1

LatticeECP2/M Family Data Sheet Revision History

Revision History ................................................................................................................................................. 7-1

Section II. LatticeECP2/M Family Technical Notes

LatticeECP2M SERDES/PCS Usage Guide

Introduction to PCS ............................................................................................................................................ 8-1

Features ............................................................................................................................................................. 8-1

Supported Standards ......................................................................................................................................... 8-2

Architecture Overview ........................................................................................................................................ 8-2

PCS Quad ................................................................................................................................................. 8-2

PCS Quad and Channels.......................................................................................................................... 8-3

Per Channel PCS/FPGA Interface Ports................................................................................................... 8-4

Locating a PCS Quad ............................................................................................................................... 8-4

Detailed Channel Block Diagram .............................................................................................................. 8-4

SCI (SERDES Client Interface) Bus.......................................................................................................... 8-7

Using This Technical Note ........................................................................................................................ 8-7

SERDES/PCS .................................................................................................................................................... 8-7

I/O Definitions............................................................................................................................................ 8-9

SERDES/PCS Functional Description ............................................................................................................. 8-12

SERDES ................................................................................................................................................. 8-12

Reference Clock Usage .......................................................................................................................... 8-13

Transmit Data.......................................................................................................................................... 8-16

Receive Data........................................................................................................................................... 8-16

Configuration GUIs........................................................................................................................................... 8-27

Configuration File Description ................................................................................................................. 8-38

LatticeECP2M PCS in Gigabit Ethernet Mode ................................................................................................. 8-39

Gigabit Ethernet (1000BASE-X) Idle Insert............................................................................................. 8-39

Gigabit Ethernet Idle Insert and ff_correct_disp_ch[3:0] Signal Usage................................................... 8-39

LatticeECP2M PCS in PCI Express Mode ....................................................................................................... 8-39

PCS Loopback Modes ..................................................................................................................................... 8-41

Serial Loopback Mode ............................................................................................................................ 8-41

SERDES Parallel Loopback Mode.......................................................................................................... 8-41

PCS Parallel Loopback Mode ................................................................................................................. 8-41

FPGA Interface Clocks Usage ......................................................................................................................... 8-42

2-to-1 Gearing ......................................................................................................................................... 8-44

SERDES/PCS Block Latency........................................................................................................................... 8-49

SERDES Client Interface (SCI)........................................................................................................................ 8-50

Interrupts and Status............................................................................................................................... 8-52

SERDES Client Interface Application Example....................................................................................... 8-53

Dynamic Configuration of SERDES/PCS Quad...................................................................................... 8-54

SERDES Debug Capabilities .................................................................................................................. 8-54

Control Boxes and Buttons, Status Boxes and the Text Window ........................................................... 8-56

Other Design Considerations ........................................................................................................................... 8-56

LatticeECP2M-35 vs. All Other LatticeECP2M Devices.......................................................................... 8-56

Recommended Resources

Stable ultra-low frequency triangle wave-square wave oscillation circuit

Power line carrier remote alarm circuit diagram

Phone anti-theft alarm 2

LA4505 power amplifier circuit

Audio signal generator circuit with low output resistance

Constant current source circuit composed of CW117 that adjusts the output current from zero

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