Resistor Networks u0026 Arrays RNET - THK FILM MOLD SIP
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Bourns |
package instruction | SIP |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Factory Lead Time | 6 weeks |
structure | Molded |
Component power consumption | 0.25 W |
The first element resistor | 100 Ω |
JESD-609 code | e0 |
Lead length | 3.43 mm |
lead spacing | 2.54 mm |
Installation features | THROUGH HOLE MOUNT |
Network Type | BUSSED |
Number of components | 9 |
Number of functions | 1 |
Number of terminals | 10 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package height | 6.35 mm |
Package length | 24.99 mm |
Package shape | RECTANGULAR PACKAGE |
Package form | SIP |
Package width | 2.16 mm |
Rated power dissipation(P) | 1.5 W |
Rated temperature | 70 °C |
resistance | 100 Ω |
Resistor type | ARRAY/NETWORK RESISTOR |
size code | 9808 |
surface mount | NO |
technology | METAL GLAZE/THICK FILM |
Temperature Coefficient | 100 ppm/°C |
Temperature coefficient tracking | 50 ppm/°C |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal shape | FLAT |
Tolerance | 2% |
Operating Voltage | 100 V |