|
DG406BDJ-E3 |
DG407DJ-E3 |
DG406BDW |
DG406AK |
DG406DW-E3 |
DG407DN-T1-E3 |
DG407BDW-E3 |
DG407BDN-T1-E3 |
DG406DJ |
Description |
Multiplexer Switch ICs Single 16:1, 4-bit Multiplexer/MUX |
Multiplexer Switch ICs Dual Diff 8:1 Multiplexer/MUX |
Multiplexer Switch ICs Single 16:1, 4-bit Multiplexer/MUX |
Multiplexer Switch ICs Single 16:1, 4-bit Multiplexer/MUX |
ESD Suppressors / TVS Diodes 6 CH DIODE ARRAY |
Instrumentation Amplifiers Precision Low Power Instrumentation Amp |
Multiplexer Switch ICs Dual Diff 8:1 Multiplexer/MUX |
Multiplexer Switch ICs Dual Diff 8:1 Multiplexer/MUX |
Multiplexer Switch ICs Single 16:1, 4-bit Multiplexer/MUX |
package instruction |
DIP, DIP28,.6 |
DIP, DIP28,.6 |
SOP, SOP28,.4 |
DIP, DIP28,.6 |
SOP, SOP28,.4 |
QCCJ, LDCC28,.5SQ |
SOP, SOP28,.4 |
QCCJ, LDCC28,.5SQ |
DIP, DIP28,.6 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
Analog Integrated Circuits - Other Types |
SINGLE-ENDED MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
JESD-30 code |
R-PDIP-T28 |
R-PDIP-T28 |
R-PDSO-G28 |
R-XDIP-T28 |
R-PDSO-G28 |
S-PQCC-J28 |
R-PDSO-G28 |
S-PQCC-J28 |
R-PDIP-T28 |
JESD-609 code |
e3 |
e3 |
e0 |
e0 |
e3 |
e3 |
e3 |
e3 |
e0 |
Number of channels |
16 |
8 |
16 |
16 |
16 |
8 |
8 |
8 |
16 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
28 |
28 |
28 |
28 |
28 |
28 |
28 |
28 |
28 |
Maximum on-state resistance (Ron) |
60 Ω |
100 Ω |
60 Ω |
125 Ω |
100 Ω |
100 Ω |
60 Ω |
60 Ω |
125 Ω |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
125 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-55 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
DIP |
SOP |
DIP |
SOP |
QCCJ |
SOP |
QCCJ |
DIP |
Encapsulate equivalent code |
DIP28,.6 |
DIP28,.6 |
SOP28,.4 |
DIP28,.6 |
SOP28,.4 |
LDCC28,.5SQ |
SOP28,.4 |
LDCC28,.5SQ |
DIP28,.6 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
SQUARE |
RECTANGULAR |
Package form |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
CHIP CARRIER |
SMALL OUTLINE |
CHIP CARRIER |
IN-LINE |
power supply |
12/+-15 V |
12/+-15 V |
12/+-15 V |
12/+-15 V |
12/+-15 V |
12/+-15 V |
12/+-15 V |
12/+-15 V |
12/+-15 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum signal current |
0.03 A |
0.02 A |
0.03 A |
0.02 A |
0.03 A |
0.03 A |
0.03 A |
0.03 A |
0.02 A |
surface mount |
NO |
NO |
YES |
NO |
YES |
YES |
YES |
YES |
NO |
Maximum connection time |
123 ns |
400 ns |
123 ns |
600 ns |
400 ns |
400 ns |
123 ns |
123 ns |
600 ns |
switch |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
MILITARY |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
TIN LEAD |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
GULL WING |
J BEND |
GULL WING |
J BEND |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
QUAD |
DUAL |
QUAD |
DUAL |
Is it lead-free? |
Lead free |
Lead free |
Contains lead |
- |
Lead free |
Lead free |
Lead free |
Lead free |
Contains lead |
Parts packaging code |
DIP |
DIP |
SOIC |
- |
SOIC |
QLCC |
SOIC |
QLCC |
DIP |
Contacts |
28 |
28 |
28 |
- |
28 |
28 |
28 |
28 |
28 |
length |
37.4 mm |
37.4 mm |
17.9 mm |
- |
17.9 mm |
11.5062 mm |
17.9 mm |
11.5062 mm |
- |
Humidity sensitivity level |
1 |
1 |
- |
- |
1 |
1 |
1 |
1 |
- |
Maximum negative supply voltage (Vsup) |
-20 V |
-20 V |
-20 V |
- |
-20 V |
-20 V |
-20 V |
-20 V |
- |
Negative supply voltage minimum (Vsup) |
-5 V |
-5 V |
-5 V |
- |
-5 V |
-5 V |
-5 V |
-5 V |
- |
Nominal Negative Supply Voltage (Vsup) |
-15 V |
-15 V |
-15 V |
- |
-15 V |
-15 V |
-15 V |
-15 V |
- |
Nominal off-state isolation |
86 dB |
69 dB |
86 dB |
- |
69 dB |
69 dB |
86 dB |
86 dB |
- |
On-state resistance matching specifications |
3 Ω |
5 Ω |
3 Ω |
- |
5 Ω |
5 Ω |
3 Ω |
3 Ω |
- |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
240 |
- |
260 |
260 |
260 |
260 |
- |
Maximum seat height |
5.08 mm |
5.08 mm |
2.54 mm |
- |
2.54 mm |
4.57 mm |
2.54 mm |
4.57 mm |
- |
Maximum supply voltage (Vsup) |
20 V |
20 V |
20 V |
- |
20 V |
20 V |
20 V |
20 V |
- |
Minimum supply voltage (Vsup) |
5 V |
5 V |
5 V |
- |
5 V |
5 V |
5 V |
5 V |
- |
Nominal supply voltage (Vsup) |
15 V |
15 V |
15 V |
- |
15 V |
15 V |
15 V |
15 V |
- |
Maximum disconnect time |
94 ns |
300 ns |
94 ns |
- |
300 ns |
300 ns |
94 ns |
94 ns |
- |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
30 |
- |
40 |
40 |
40 |
40 |
- |
width |
15.24 mm |
15.24 mm |
7.5 mm |
- |
7.5 mm |
11.5062 mm |
7.5 mm |
11.5062 mm |
- |
Base Number Matches |
1 |
1 |
- |
- |
1 |
1 |
- |
1 |
1 |