LVDS Interface IC
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Microsemi |
Parts packaging code | TSSOP |
package instruction | TSSOP, TSSOP24,.25 |
Contacts | 24 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Differential output | YES |
Interface integrated circuit type | SCSI BUS TERMINATOR |
JESD-30 code | R-PDSO-G24 |
JESD-609 code | e3 |
length | 7.8 mm |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of signal lines | 9 |
Number of terminals | 24 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Encapsulate equivalent code | TSSOP24,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3.3 V |
Nominal pull-up resistor | 105 Ω |
Certification status | Not Qualified |
Maximum seat height | 1.1 mm |
Maximum supply voltage | 5.25 V |
Minimum supply voltage | 2.7 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
width | 4.4 mm |