EMX1DXV6T1,
EMX1DXV6T5
Preferred Devices
Dual NPN General Purpose
Amplifier Transistor
This NPN transistor is designed for general purpose amplifier
applications. This device is housed in the SOT-563 package which is
designed for low power surface mount applications, where board
space is at a premium.
Features
http://onsemi.com
•
•
•
•
Reduces Board Space
High h
FE
, 210−460 (Typical)
Low V
CE(sat)
, < 0.5 V
These are Pb−Free Devices
DUAL NPN GENERAL
PURPOSE AMPLIFIER
TRANSISTORS
SURFACE MOUNT
(6)
(5)
(4)
MAXIMUM RATINGS
(T
A
= 25°C)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current − Continuous
Symbol
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
C
Value
60
50
7.0
100
Unit
Vdc
Vdc
Vdc
mAdc
(1)
(2)
(3)
Tr
1
Tr
2
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance −
Junction-to-Ambient
Characteristic
(Both Junctions Heated)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance −
Junction-to-Ambient
Junction and Storage
Temperature Range
Symbol
P
D
357 (Note 1)
2.9 (Note 1)
R
qJA
350 (Note 1)
mW
mW/°C
°C/W
Max
Unit
6
1
SOT−563
CASE 463A
STYLE 1
Symbol
P
D
Max
500 (Note 1)
4.0 (Note 1)
Unit
mW
mW/°C
°C/W
°C
3X M
G
G
1
3X = Specific Device Code
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
MARKING DIAGRAM
R
qJA
T
J
, T
stg
250 (Note 1)
−55 to +150
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−4 @ Minimum Pad
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
©
Semiconductor Components Industries, LLC, 2005
1
November, 2005 − Rev. 1
Publication Order Number:
EMX1DXV6T1/D
EMX1DXV6T1, EMX1DXV6T5
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C)
Characteristic
Collector-Base Breakdown Voltage
(I
C
= 50
mAdc,
I
E
= 0)
Collector-Emitter Breakdown Voltage
(I
C
= 1.0 mAdc, I
B
= 0)
Emitter-Base Breakdown Voltage
(I
E
= 50
mAdc,
I
E
= 0)
Collector-Base Cutoff Current
(V
CB
= 60 Vdc, I
E
= 0)
Emitter-Base Cutoff Current
(V
EB
= 7.0 Vdc, I
B
= 0)
Collector-Emitter Saturation Voltage (Note 2)
(I
C
= 50 mAdc, I
B
= 5.0 mAdc)
DC Current Gain (Note 3)
(V
CE
= 6.0 Vdc, I
C
= 1.0 mAdc)
Transition Frequency
(V
CE
= 12 Vdc, I
C
= 2.0 mAdc, f = 30 MHz)
Output Capacitance
(V
CB
= 12 Vdc, I
C
= 0 Adc, f = 1 MHz)
Symbol
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CBO
I
EBO
V
CE(sat)
−
h
FE
120
f
T
C
OB
−
−
−
180
2.0
560
−
−
MHz
pF
−
0.4
−
Min
60
50
7.0
−
−
Typ
−
−
−
−
−
Max
−
−
−
0.5
0.5
Unit
Vdc
Vdc
Vdc
mA
mA
Vdc
2. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
3. Pulse Test: Pulse Width
≤
300
ms,
D.C.
≤
2%.
ORDERING INFORMATION
Device
EMX1DXV6T1
EMX1DXV6T1G
EMX1DXV6T5
EMX1DXV6T5G
Package
SOT−563*
SOT−563*
SOT−563*
SOT−563*
Shipping
†
4000 Units / Tape & Reel
4000 Units / Tape & Reel
8000 Units / Tape & Reel
8000 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
http://onsemi.com
2
EMX1DXV6T1, EMX1DXV6T5
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
D
−X−
A
L
4
6
5
1
2
3
E
−Y−
H
E
DIM
A
b
C
D
E
e
L
H
E
b
e
5
6 PL
M
C
X Y
0.08 (0.003)
STYLE 1:
PIN 1. EMITTER 1
2. BASE 1
3. COLLECTOR 2
4. EMITTER 2
5. BASE 2
6. COLLECTOR 1
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support:
800−282−9855 Toll Free
Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone:
480−829−7710 or 800−344−3860 Toll Free USA/Canada
Japan:
ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax:
480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone:
81−3−5773−3850
Email:
orderlit@onsemi.com
ON Semiconductor Website:
http://onsemi.com
Order Literature:
http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
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4
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