16Kbit and 8Kbit Serial SPI Bus EEPROM With High Speed Clock
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | STMicroelectronics |
Parts packaging code | SOIC |
package instruction | 2 X 3 MM, MLP-8 |
Contacts | 8 |
Reach Compliance Code | _compli |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 2 MHz |
Data retention time - minimum | 40 |
Durability | 1000000 Write/Erase Cycles |
JESD-30 code | R-XDSO-N8 |
JESD-609 code | e0 |
length | 3 mm |
memory density | 16384 bi |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 2048 words |
character code | 2000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
organize | 2KX8 |
Package body material | UNSPECIFIED |
encapsulated code | VSON |
Encapsulate equivalent code | SOLCC8,.11,20 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, VERY THIN PROFILE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3/5 V |
Certification status | Not Qualified |
Maximum seat height | 0.6 mm |
Serial bus type | SPI |
Maximum standby current | 0.000002 A |
Maximum slew rate | 0.005 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2.5 V |
Nominal supply voltage (Vsup) | 4.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 2 mm |
Maximum write cycle time (tWC) | 10 ms |
write protect | HARDWARE/SOFTWARE |