HIGH POWER SWITCHING APPLICATIONS MOTOR CONTROL APPLICATIONS
Parameter Name | Attribute value |
Maker | Toshiba Semiconductor |
package instruction | FLANGE MOUNT, R-XUFM-P24 |
Contacts | 24 |
Reach Compliance Code | unknow |
Maximum collector current (IC) | 25 A |
Collector-emitter maximum voltage | 600 V |
Gate-emitter maximum voltage | 20 V |
JESD-30 code | R-XUFM-P24 |
Number of components | 1 |
Number of terminals | 24 |
Maximum operating temperature | 150 °C |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | FLANGE MOUNT |
Maximum power dissipation(Abs) | 90 W |
Certification status | Not Qualified |
surface mount | NO |
Terminal form | PIN/PEG |
Terminal location | UPPER |
VCEsat-Max | 2.7 V |
MIG20J906HA | MIG20J906H | |
---|---|---|
Description | HIGH POWER SWITCHING APPLICATIONS MOTOR CONTROL APPLICATIONS | HIGH POWER SWITCHING APPLICATIONS MOTOR CONTROL APPLICATIONS |
Maker | Toshiba Semiconductor | Toshiba Semiconductor |
Reach Compliance Code | unknow | unknow |
Maximum collector current (IC) | 25 A | 20 A |
Collector-emitter maximum voltage | 600 V | 600 V |
JESD-30 code | R-XUFM-P24 | R-XUFM-P24 |
Number of components | 1 | 6 |
Number of terminals | 24 | 24 |
Maximum operating temperature | 150 °C | 150 °C |
Package body material | UNSPECIFIED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | FLANGE MOUNT | FLANGE MOUNT |
Certification status | Not Qualified | Not Qualified |
surface mount | NO | NO |
Terminal form | PIN/PEG | PIN/PEG |
Terminal location | UPPER | UPPER |