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74LVC16244AEV

Description
Buffers u0026 Line Drivers 3.3V BUF/LN DRVR N-INV 3S
Categorylogic    logic   
File Size195KB,15 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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74LVC16244AEV Overview

Buffers u0026 Line Drivers 3.3V BUF/LN DRVR N-INV 3S

74LVC16244AEV Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerNXP
Parts packaging codeBGA
package instructionVFBGA, BGA56,6X10,25
Contacts56
Manufacturer packaging codeSOT702-1
Reach Compliance Codenot_compliant
Control typeENABLE LOW
seriesLVC/LCX/Z
JESD-30 codeR-PBGA-B56
JESD-609 codee0
length7 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.024 A
Humidity sensitivity level2
Number of digits4
Number of functions4
Number of ports2
Number of terminals56
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA56,6X10,25
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Prop。Delay @ Nom-Sup5.5 ns
propagation delay (tpd)6 ns
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.2 V
Nominal supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch0.65 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width4.5 mm
Base Number Matches1

74LVC16244AEV Related Products

74LVC16244AEV 74LVC16244ADL 74LVC16244ADL-T 74LVC16244ADL112 74LVC16244ADL118 74LVC16244AEV-S 74LVC16244AEV157 74LVC16244AEVY 74LVCH16244AEVK
Description Buffers u0026 Line Drivers 3.3V BUF/LN DRVR N-INV 3S Buffers u0026 Line Drivers 3.3V 16-BIT DRVR 3-S Buffers u0026 Line Drivers 3.3V 16-BIT DRVR 3-S Switching Voltage Regulators 2A Dual Non-Synch Buck Conv Voltage References 2.048V u0026 2.5V Bandgap Buffers u0026 Line Drivers 3.3V BUF/LN DRVR N-INV 3S Buffers u0026 Line Drivers 3.3V BUF/LN DRVR Buffers u0026 Line Drivers 74LVC16244AEV/VFBGA56/REEL 13 Buffers u0026 Line Drivers 74LVCH16244AEV/VFBGA56/STANDAR
Is it Rohs certified? incompatible conform to conform to - - incompatible - incompatible incompatible
Maker NXP NXP NXP - - NXP - NXP NXP
Parts packaging code BGA SSOP SSOP - - - - BGA BGA
package instruction VFBGA, BGA56,6X10,25 SSOP, SSOP48,.4 SSOP, SSOP48,.4 - - FBGA, BGA56,6X10,25 - VFBGA, BGA56,6X10,25 VFBGA, BGA56,6X10,25
Contacts 56 48 48 - - - - 56 56
Reach Compliance Code not_compliant unknown unknown - - unknown - unknown unknown
Control type ENABLE LOW ENABLE LOW ENABLE LOW - - ENABLE LOW - ENABLE LOW ENABLE LOW
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z - - - - LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-PBGA-B56 R-PDSO-G48 R-PDSO-G48 - - R-PBGA-B56 - R-PBGA-B56 R-PBGA-B56
JESD-609 code e0 e4 e4 - - - - e0 e0
length 7 mm 15.875 mm 15.875 mm - - - - 7 mm 7 mm
Load capacitance (CL) 50 pF 50 pF 50 pF - - 50 pF - 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER - - BUS DRIVER - BUS DRIVER BUS DRIVER
MaximumI(ol) 0.024 A 0.024 A 0.024 A - - 0.024 A - 0.024 A 0.024 A
Number of digits 4 4 4 - - 4 - 4 4
Number of functions 4 4 4 - - 4 - 4 4
Number of ports 2 2 2 - - - - 2 2
Number of terminals 56 48 48 - - 56 - 56 56
Maximum operating temperature 125 °C 125 °C 125 °C - - 125 °C - 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C - - -40 °C - -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE - - 3-STATE - 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE - - TRUE - TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA SSOP SSOP - - FBGA - VFBGA VFBGA
Encapsulate equivalent code BGA56,6X10,25 SSOP48,.4 SSOP48,.4 - - BGA56,6X10,25 - BGA56,6X10,25 BGA56,6X10,25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - - RECTANGULAR - RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH - - GRID ARRAY, FINE PITCH - GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing TAPE AND REEL TUBE TAPE AND REEL - - TRAY - TAPE AND REEL TRAY
power supply 3.3 V 3.3 V 3.3 V - - 3.3 V - 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 5.5 ns 5.5 ns 5.5 ns - - 5.5 ns - 5.5 ns 5.5 ns
propagation delay (tpd) 6 ns 6 ns 6 ns - - - - 6 ns 6 ns
Certification status Not Qualified Not Qualified Not Qualified - - Not Qualified - Not Qualified Not Qualified
Maximum seat height 1 mm 2.8 mm 2.8 mm - - - - 1 mm 1 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V - - - - 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1.2 V 1.2 V 1.2 V - - - - 1.2 V 1.2 V
Nominal supply voltage (Vsup) 2.7 V 2.7 V 2.7 V - - 3.3 V - 2.7 V 2.7 V
surface mount YES YES YES - - YES - YES YES
technology CMOS CMOS CMOS - - CMOS - CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - - AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin/Lead (Sn63Pb37) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD - - - - TIN LEAD TIN LEAD
Terminal form BALL GULL WING GULL WING - - BALL - BALL BALL
Terminal pitch 0.65 mm 0.635 mm 0.635 mm - - 0.635 mm - 0.65 mm 0.65 mm
Terminal location BOTTOM DUAL DUAL - - BOTTOM - BOTTOM BOTTOM
width 4.5 mm 7.5 mm 7.5 mm - - - - 4.5 mm 4.5 mm
Base Number Matches 1 1 1 - - 1 - 1 1
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