TDM-3730
4
3
5
2
6
1
2
System on Module
TI Sitara DM3730 1GHz application processor
with ARM Cortex-A8 CPU, and
POWERVR SGX 530 for 2D and 3D
graphics acceleration.
200 pin SO-DIMM connector carrying LAN,
USB, UART, SPI, I²C, LCD, Camera signals
making the TDM-3730 ideal for demanding
multimedia application.
System
CPU
DSP core
PMIC
Memory
Interfaces
Connectors
200 pin SO-DIMM with SPI, UART,
USB host, USB OTG/ client, I
2
C,
PWM lines, 1-wire, MMC lines,
A/D lines, camera, audio in/out, mic
keypad, S-Video, Display, LAN
62.1
Graphic Capabilities
Chipset
API support
Order Information
2012-01. All specifications are subject to change without notice.
Power
POWERVR SGX 530
20Mpolys/s, up to 720p resolution
OpenGL 2.0, OpenGLes 1.1,
OpenVG 1.0
TDM-3730
TDM-3730-i
TDM-3730W
Power consumption
Standby
Input power
<2.0 Watt with Wireless enabled
<50 mWatt
5V
DM3730 System on Module
DM3730 System on module
with industrial temperature
specifications (MOQ’s apply)
DM3730 System on Module
with Wireless LAN 802.11 b/g
Development kits available
Environmental and Mechanical
Temperature
Humidity
Dimensions
MTBF
Weight
Shock
Vibration
Commercial: 0° to 70° C
Extended: -20° to 70° C (no wifi)
Industrial: -40° to 85° C (no wifi)
10-90%
67.6x 50x 3.4 mm (2⅝x 2x ¼ inch)
>100,000 hours
12 grams
50G / 25ms
20G / 0-600 Hz
Phone: +886-2-8227-3585
E-mail: sales@technexion.com
Web:
http://www.technexion.com
47.25
Storage
Wireless LAN
Network
Supported OS
TI Sitara 3730 @ 1GHz (1)
TMS320C64x+
TM
@ 800MHz
TPS65930 (6)
512 MB Low power mobile DDR (2)
optional configurations upto 1GB
512 MB NAND Flash (3)
Marvell 8686 802.11b/g (4)
SMSC LAN 9220 (5)
Linux 2.6.x, Windows Embedded
Compact 7 and Android
Dimensions
units in mm
67.6
M2
50
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
