variable attenuator (VVA) is designed to interface with
50I systems operating in the 500MHz to 4000MHz
frequency range. The device includes a patented control
circuit that provides 23.2dB of attenuation range (per
attenuator) with a typical linear control slope of 8.5dB/V.
Both attenuators share a common analog control and
can be cascaded together to yield 46.4dB of total attenu-
ation range with a typical combined linear control slope
of 17dB/ V (5V operation).
Alternatively, the on-chip 4-wire SPI-controlled 10-bit
DAC can be used to control both attenuators. In addi-
tion, a step-up/down feature allows user-programmable
attenuator stepping through command pulses without
reprogramming the SPI interface.
The MAX19792 is a monolithic device designed using
one of Maxim’s proprietary SiGe BiCMOS processes. The
part operates from a single +5V supply or alternatively
from a single +3.3V supply. It is available in a compact
36-pin TQFN package (6mm x 6mm x 0.8mm) with an
exposed pad. Electrical performance is guaranteed over
the -40NC to +100NC extended temperature range.
Features
S
Wideband Coverage
500MHz to 4000MHz RF Frequency Range
S
High Linearity
Greater Than +37.9dBm IIP3 Over the Full
Attenuation Range
+22.7dBm Input P
1dB
S
Integrates Two Analog Attenuators in One
Monolithic Device
S
Two Convenient Control Options
Single Analog Voltage
On-Chip SPI-Controlled 10-Bit DAC
S
Step-Up /Down Pulse Command Inputs
S
Flexible Attenuation Control Ranges
23.2dB (Per Attenuator)
46.4dB (Both Attenuators Cascaded)
S
Linear dB/V Analog Control Response Curve
Simplifies Automatic Leveling Control and
Gain-Trim Algorithms
S
Excellent Attenuation Flatness Over Wide
Frequency Ranges and Attenuation Settings
S
On-Chip Comparator (for Successive
Approximation Measurement of Attenuator
Control Voltage)
S
Low 13mA Supply Current
S
Single 5V or 3.3V Supply Voltage
S
Pin-Compatible with the MAX19791 and MAX19793
S
Pin-Compatible with the MAX19794 with Addition
of Two Shunt Capacitors
S
PCB-Compatible with the MAX19790
S
Lead(Pb)-Free Package
Applications
Broadband System Applications, Including
Wireless Infrastructure Digital and
Spread-Spectrum Communication Systems
WCDMA/LTE, TD-SCDMA/TD-LTE, WiMAX®,
cdma2000
M
, GSM/EDGE, and
MMDS Base Stations
VSAT/Satellite Modems
Microwave Point-to-Point Systems
Lineup Gain Trim
Temperature-Compensation Circuits
Automatic Level Control (ALC)
Transmitter Gain Control
Receiver Gain Control
General Test Equipment
Ordering Information
appears at end of data sheet.
For related parts and recommended products to use with this part,
refer to
www.maximintegrated.com/MAX19792.related.
WiMAX® is a registered certification mark and registered service mark of WiMAX Forum.
cdma2000 is a registered trademark of Telecommunications Industry Association.
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-6382; Rev 2; 5/15
MAX19792
500MHz to 4000MHz Dual Analog Voltage Variable
Attenuator with On-Chip 10-Bit SPI-Controlled DAC
ABSOLUTE MAXIMUM RATINGS
V
CC
.......................................................................-0.3V to +5.5V
REF_IN..............................-0.3V to Minimum (V
CC
+ 0.3V, 3.6V)
REF_SEL, DAC_LOGIC, MODE, DWN, UP,
DIN, CLK,
CS
............... -0.3V to Minimum (V
CC
+ 0.3V, 3.6V)
COMP_OUT, DOUT ..............................................-0.3V to +3.6V
IN_A, OUT_A, IN_B, OUT_B .......................-0.3V to V
CC
+ 0.3V
CTRL (except for test mode).......................-0.3V to V
CC
+ 0.3V
Maximum CTRL Pin Load Current
(CTRL configured as an output)....................................0.3mA
RF Input Power at IN_A, IN_B, OUT_A, OUT_B ........... +20dBm
Continuous Power Dissipation (Note 1) ..............................2.8W
Operating Case Temperature Range (Note 2)…-40NC to +100NC
Maximum Junction Temperature.....................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 1:
Based on junction temperature T
J
= T
C
+ (B
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details.
The junction temperature must not exceed +150NC.
Note 2:
T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
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