Part Number | Manufacturer | Description | Datasheet |
---|---|---|---|
ZL30316GKG2 | Microsemi | IC timing-over-packet 256tebga-2 | Download |
ZL30316GKG2 | Zarlink Semiconductor (Microsemi) | Telecom Circuit, 1-Func, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-034B, TEBGA-256 | Download |
Telecom Circuit, 1-Func, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-034B, TEBGA-256
Parameter Name | Attribute value |
Maker | Zarlink Semiconductor (Microsemi) |
Objectid | 1801805457 |
package instruction | BGA, |
Reach Compliance Code | unknown |
compound_id | 219692889 |
JESD-30 code | S-PBGA-B256 |
length | 17 mm |
Number of functions | 1 |
Number of terminals | 256 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Certification status | Not Qualified |
Maximum seat height | 1.97 mm |
surface mount | YES |
Telecom integrated circuit types | TELECOM CIRCUIT |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
width | 17 mm |