EEWORLDEEWORLDEEWORLD

Part Number

Search
Datasheet >

ZL30316GKG2

Among 2 related components, ZL30316GKG2 have related pdf.
Part Number Manufacturer Description Datasheet
ZL30316GKG2 Microsemi IC timing-over-packet 256tebga-2 Download
ZL30316GKG2 Zarlink Semiconductor (Microsemi) Telecom Circuit, 1-Func, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-034B, TEBGA-256 Download
ZL30316GKG2 parameters:

Description

Telecom Circuit, 1-Func, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-034B, TEBGA-256

Parametric
Parameter NameAttribute value
MakerZarlink Semiconductor (Microsemi)
Objectid1801805457
package instructionBGA,
Reach Compliance Codeunknown
compound_id219692889
JESD-30 codeS-PBGA-B256
length17 mm
Number of functions1
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height1.97 mm
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width17 mm

Technical ResourceMore

ForumMore

Technical VideoMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Search Index   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Index   0B 13 1K 3B CC DG EG GQ KI KW PB PT Q3 TY VG

Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号