Part Number | Manufacturer | Description | Datasheet |
---|---|---|---|
WEDPN8M64V-133B2M | White Electronic Designs Corporation | 8Mx64 Synchronous DRAM | Download |
WEDPN8M64V-133B2M | Microsemi | Synchronous DRAM, 8MX64, 5.5ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219 | Download |
Synchronous DRAM, 8MX64, 5.5ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 1667210510 |
package instruction | BGA, |
Reach Compliance Code | unknown |
access mode | FOUR BANK PAGE BURST |
Maximum access time | 5.5 ns |
Other features | AUTO/SELF REFRESH |
Spare memory width | 32 |
JESD-30 code | S-PBGA-B219 |
memory density | 536870912 bit |
Memory IC Type | SYNCHRONOUS DRAM |
memory width | 64 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 219 |
word count | 8388608 words |
character code | 8000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 8MX64 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
self refresh | YES |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |