Part Number | Manufacturer | Description | Datasheet |
---|---|---|---|
W9816G6CB-7 | Winbond Electronics Corporation | Synchronous DRAM, 1MX16, 5ns, CMOS, PBGA60, 0.65 MM PITCH, ROHS COMPLIANT, VFBGA-60 | Download |
Synchronous DRAM, 1MX16, 5ns, CMOS, PBGA60, 0.65 MM PITCH, ROHS COMPLIANT, VFBGA-60
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Winbond(华邦电子) |
Parts packaging code | BGA |
package instruction | TFBGA, BGA60,7X15,25 |
Contacts | 60 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
access mode | DUAL BANK PAGE BURST |
Maximum access time | 5 ns |
Other features | AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) | 143 MHz |
I/O type | COMMON |
interleaved burst length | 1,2,4,8 |
JESD-30 code | R-PBGA-B60 |
JESD-609 code | e1 |
length | 10.1 mm |
memory density | 16777216 bit |
Memory IC Type | SYNCHRONOUS DRAM |
memory width | 16 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 60 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA60,7X15,25 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3/3.3 V |
Certification status | Not Qualified |
refresh cycle | 4096 |
Maximum seat height | 1.1 mm |
self refresh | YES |
Continuous burst length | 1,2,4,8,FP |
Maximum standby current | 0.002 A |
Maximum slew rate | 0.1 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | BALL |
Terminal pitch | 0.65 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 6.4 mm |