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W9812G6JB

Showing 6 Results for W9812G6JB, including W9812G6JB,W9812G6JB-6, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
W9812G6JB Winbond Electronics Corporation 8M X 16 SYNCHRONOUS DRAM, 5 ns, PBGA54 Download
W9812G6JB-6 Winbond Electronics Corporation 8M X 16 SYNCHRONOUS DRAM, 5 ns, PBGA54 Download
W9812G6JB-6I Winbond Electronics Corporation 8M X 16 SYNCHRONOUS DRAM, 5 ns, PBGA54 Download
W9812G6JB-6I TR Winbond Electronics Corporation Dynamic random access memory 128M SDR S dynamic random access memory x16, 166MHz, Ind temp Download
W9812G6JB-6 TR Winbond Electronics Corporation Dynamic random access memory 128M SDR S dynamic random access memory x16, 166MHz, Download
W9812G6JB-75 Winbond Electronics Corporation 8M X 16 SYNCHRONOUS DRAM, 5 ns, PBGA54 Download
W9812G6JB Related Product Datasheets:
Part Number Datasheet
W9812G6JB 、 W9812G6JB-6 、 W9812G6JB-6I 、 W9812G6JB-75 Download Datasheet
W9812G6JB-6 TR 、 W9812G6JB-6I TR Download Datasheet
W9812G6JB Related Products:
Part Number W9812G6JB-75 W9812G6JB W9812G6JB-6 W9812G6JB-6I
Description 8M X 16 SYNCHRONOUS DRAM, 5 ns, PBGA54 8M X 16 SYNCHRONOUS DRAM, 5 ns, PBGA54 8M X 16 SYNCHRONOUS DRAM, 5 ns, PBGA54 8M X 16 SYNCHRONOUS DRAM, 5 ns, PBGA54
Number of functions 1 1 1 1
Number of terminals 54 54 54 54
Maximum operating temperature 85 Cel 85 Cel 85 Cel 85 Cel
Minimum operating temperature -40 Cel -40 Cel -40 Cel -40 Cel
Maximum supply/operating voltage 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply/operating voltage 3 V 3 V 3 V 3 V
Rated supply voltage 3.3 V 3.3 V 3.3 V 3.3 V
Minimum access time 5 ns 5 ns 5 ns 5 ns
Processing package description 8 × 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-54 8 × 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-54 8 × 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-54 8 × 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-54
state ACTIVE ACTIVE ACTIVE ACTIVE
Craftsmanship CMOS CMOS CMOS CMOS
packaging shape SQUARE SQUARE SQUARE SQUARE
Package Size GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
surface mount Yes Yes Yes Yes
Terminal form BALL BALL BALL BALL
Terminal spacing 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm
terminal coating NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Packaging Materials Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
memory width 16 16 16 16
organize 8M × 16 8M × 16 8M × 16 8M × 16
storage density 1.34E8 deg 1.34E8 deg 1.34E8 deg 1.34E8 deg
operating mode Synchronize Synchronize Synchronize Synchronize
Access method Four BANK PAGE BURST Four BANK PAGE BURST Four BANK PAGE BURST Four BANK PAGE BURST
Memory IC type synchronous dynamic random access memory synchronous dynamic random access memory synchronous dynamic random access memory synchronous dynamic random access memory
Number of ports 1 1 1 1
Number of digits 8M 8M 8M 8M

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