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W9812G2KB-6

Showing 4 Results for W9812G2KB-6, including W9812G2KB-6,W9812G2KB-6I, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
W9812G2KB-6 Winbond Electronics Corporation 1M X 4 BANKS X 32 BITS SDRAM Download
W9812G2KB-6I Winbond Electronics Corporation 1M X 4 BANKS X 32 BITS SDRAM Download
W9812G2KB-6I TR Winbond Electronics Corporation Dynamic random access memory 128M SDR S dynamic random access memory x32, 166MHz, Download
W9812G2KB-6 TR Winbond Electronics Corporation Dynamic random access memory 128M SDR S dynamic random access memory x32, 166MHz, Download
W9812G2KB-6 Related Product Datasheets:
Part Number Datasheet
W9812G2KB-6 TR 、 W9812G2KB-6I TR Download Datasheet
W9812G2KB-6 、 W9812G2KB-6I Download Datasheet
W9812G2KB-6 Related Products:
Part Number W9812G2KB-6 W9812G2KB-6I
Description 1M X 4 BANKS X 32 BITS SDRAM 1M X 4 BANKS X 32 BITS SDRAM
Maker Winbond Electronics Corporation Winbond Electronics Corporation
package instruction TFBGA, TFBGA,
Reach Compliance Code compli compli
ECCN code EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 6 ns 6 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-PBGA-B90 R-PBGA-B90
length 13 mm 13 mm
memory density 134217728 bi 134217728 bi
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 32 32
Number of functions 1 1
Number of ports 1 1
Number of terminals 90 90
word count 4194304 words 4194304 words
character code 4000000 4000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 85 °C
organize 4MX32 4MX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Maximum seat height 1.2 mm 1.2 mm
self refresh YES YES
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL
Terminal form BALL BALL
Terminal pitch 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM
width 8 mm 8 mm

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