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W9725G6KB25I

Among 3 related components, W9725G6KB25I have related pdf.
Part Number Manufacturer Description Datasheet
W9725G6KB25I Winbond Electronics Corporation 16M X 16 DDR DRAM, 0.4 ns, PBGA84 Download
W9725G6KB25I TR Winbond Electronics Corporation Dynamic Random Access Memory 256M DDR2-800, x16, Ind temp T&R Download
W9725G6KB25I-TR Winbond Electronics Corporation 4M X 4 BANKS X 16 BIT DDR2 SDRAM Download
W9725G6KB25I parameters:

Description

16M X 16 DDR DRAM, 0.4 ns, PBGA84

Parametric
Parameter NameAttribute value
Is it Rohs certified?conform to
MakerWinbond(华邦电子)
Parts packaging codeBGA
package instructionWBGA-84
Contacts84
Reach Compliance Codecompli
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time0.4 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)400 MHz
I/O typeCOMMON
interleaved burst length4,8
JESD-30 codeR-PBGA-B84
length12.5 mm
memory density268435456 bi
Memory IC TypeDDR DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals84
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize16MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA84,9X15,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.8 V
Certification statusNot Qualified
refresh cycle8192
Maximum seat height1.2 mm
self refreshYES
Continuous burst length4,8
Maximum standby current0.006 A
Maximum slew rate0.135 mA
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm

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