EEWORLDEEWORLDEEWORLD

Part Number

Search
Datasheet >

W631GG8KB-12

Showing 5 Results for W631GG8KB-12, including W631GG8KB-12,W631GG8KB12A, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
W631GG8KB-12 Winbond Electronics Corporation DDR DRAM, 128MX8, 0.225ns, CMOS, PBGA78, WBGA-78 Download
W631GG8KB12A Winbond Electronics Corporation DDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78 Download
W631GG8KB12I Winbond Electronics Corporation IC DRAM 1G PARALLEL 78WBGA Download
W631GG8KB12I TR Winbond Electronics Corporation IC DRAM 1G PARALLEL 78WBGA Download
W631GG8KB12K Winbond Electronics Corporation DDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78 Download
W631GG8KB-12 Related Product Datasheets:
Part Number Datasheet
W631GG8KB12I 、 W631GG8KB12I TR Download Datasheet
W631GG8KB12A 、 W631GG8KB12K Download Datasheet
W631GG8KB-12 Download Datasheet
W631GG8KB-12 Related Products:
Part Number W631GG8KB12K W631GG8KB12A
Description DDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78 DDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker Winbond Electronics Corporation Winbond Electronics Corporation
package instruction TFBGA, TFBGA,
Reach Compliance Code compli compli
access mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Maximum access time 20 ns 20 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-PBGA-B78 R-PBGA-B78
length 10.5 mm 10.5 mm
memory density 1073741824 bi 1073741824 bi
Memory IC Type DDR DRAM DDR DRAM
memory width 8 8
Number of functions 1 1
Number of ports 1 1
Number of terminals 78 78
word count 134217728 words 134217728 words
character code 128000000 128000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 105 °C 95 °C
Minimum operating temperature -40 °C -40 °C
organize 128MX8 128MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Maximum seat height 1.2 mm 1.2 mm
self refresh YES YES
Maximum supply voltage (Vsup) 1.575 V 1.575 V
Minimum supply voltage (Vsup) 1.425 V 1.425 V
Nominal supply voltage (Vsup) 1.5 V 1.5 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL
Terminal pitch 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 8 mm 8 mm

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Search Index   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Index   58 68 6N F2 I3 IU MM P3 PP QN R3 T5 TW UP WV

Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号