Part Number |
W631GG8KB12K |
W631GG8KB12A |
Description |
DDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78 |
DDR DRAM, 128MX8, 20ns, CMOS, PBGA78, 8 X 10.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-78 |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
package instruction |
TFBGA, |
TFBGA, |
Reach Compliance Code |
compli |
compli |
access mode |
MULTI BANK PAGE BURST |
MULTI BANK PAGE BURST |
Maximum access time |
20 ns |
20 ns |
Other features |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
JESD-30 code |
R-PBGA-B78 |
R-PBGA-B78 |
length |
10.5 mm |
10.5 mm |
memory density |
1073741824 bi |
1073741824 bi |
Memory IC Type |
DDR DRAM |
DDR DRAM |
memory width |
8 |
8 |
Number of functions |
1 |
1 |
Number of ports |
1 |
1 |
Number of terminals |
78 |
78 |
word count |
134217728 words |
134217728 words |
character code |
128000000 |
128000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
105 °C |
95 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
organize |
128MX8 |
128MX8 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TFBGA |
TFBGA |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
Maximum seat height |
1.2 mm |
1.2 mm |
self refresh |
YES |
YES |
Maximum supply voltage (Vsup) |
1.575 V |
1.575 V |
Minimum supply voltage (Vsup) |
1.425 V |
1.425 V |
Nominal supply voltage (Vsup) |
1.5 V |
1.5 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
BALL |
BALL |
Terminal pitch |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
8 mm |
8 mm |