Part Number |
W3E32M64S-333SBM |
W3E32M64S-333SBM |
Description |
DDR DRAM, 32MX64, 0.7ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208 |
DDR DRAM, 32MX64, 0.7ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208 |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
Mercury Systems Inc |
Microsemi |
package instruction |
13 X 22 MM, PLASTIC, BGA-208 |
13 X 22 MM, PLASTIC, BGA-208 |
Reach Compliance Code |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
access mode |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
Maximum access time |
0.7 ns |
0.7 ns |
Other features |
AUTO REFRESH |
AUTO REFRESH |
JESD-30 code |
R-PBGA-B208 |
R-PBGA-B208 |
JESD-609 code |
e0 |
e0 |
memory density |
2147483648 bit |
2147483648 bit |
Memory IC Type |
DDR DRAM |
DDR DRAM |
memory width |
64 |
64 |
Number of functions |
1 |
1 |
Number of ports |
1 |
1 |
Number of terminals |
208 |
208 |
word count |
33554432 words |
33554432 words |
character code |
32000000 |
32000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
organize |
32MX64 |
32MX64 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
BGA |
BGA |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY |
GRID ARRAY |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
Certification status |
Not Qualified |
Not Qualified |
Maximum supply voltage (Vsup) |
2.7 V |
2.7 V |
Minimum supply voltage (Vsup) |
2.3 V |
2.3 V |
Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
Terminal surface |
TIN LEAD |
TIN LEAD |
Terminal form |
BALL |
BALL |
Terminal pitch |
1 mm |
1 mm |
Terminal location |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |