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W3E32M64S-333SBM

Showing 3 Results for W3E32M64S-333SBM, including W3E32M64S-333SBM,W3E32M64S-333SBM, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
W3E32M64S-333SBM White Electronic Designs Corporation DDR DRAM Download
W3E32M64S-333SBM Microsemi DDR DRAM, 32MX64, 0.7ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208 Download
W3E32M64S-333SBM Mercury Systems Inc DDR DRAM, 32MX64, 0.7ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208 Download
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W3E32M64S-333SBM 、 W3E32M64S-333SBM Download Datasheet
W3E32M64S-333SBM Download Datasheet
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Part Number W3E32M64S-333SBM W3E32M64S-333SBM
Description DDR DRAM, 32MX64, 0.7ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208 DDR DRAM, 32MX64, 0.7ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208
Is it Rohs certified? incompatible incompatible
Maker Mercury Systems Inc Microsemi
package instruction 13 X 22 MM, PLASTIC, BGA-208 13 X 22 MM, PLASTIC, BGA-208
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 0.7 ns 0.7 ns
Other features AUTO REFRESH AUTO REFRESH
JESD-30 code R-PBGA-B208 R-PBGA-B208
JESD-609 code e0 e0
memory density 2147483648 bit 2147483648 bit
Memory IC Type DDR DRAM DDR DRAM
memory width 64 64
Number of functions 1 1
Number of ports 1 1
Number of terminals 208 208
word count 33554432 words 33554432 words
character code 32000000 32000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C
organize 32MX64 32MX64
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified
Maximum supply voltage (Vsup) 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V 2.3 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V
surface mount YES YES
technology CMOS CMOS
Temperature level MILITARY MILITARY
Terminal surface TIN LEAD TIN LEAD
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED

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