Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Winbond(华邦电子) |
package instruction | HVSON, SOLCC8,.25 |
Reach Compliance Code | compliant |
Samacsys Description | Winbond W25Q80DVZPIG, Quad-SPI NOR 8Mbit Flash Memory Chip, 8-Pin WSON |
Maximum clock frequency (fCLK) | 104 MHz |
Data retention time - minimum | 20 |
Durability | 100000 Write/Erase Cycles |
JESD-30 code | R-PDSO-N8 |
length | 6 mm |
memory density | 8388608 bit |
Memory IC Type | FLASH |
memory width | 1 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 8388608 words |
character code | 8000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 8MX1 |
Package body material | PLASTIC/EPOXY |
encapsulated code | HVSON |
Encapsulate equivalent code | SOLCC8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3/3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 0.8 mm |
Serial bus type | SPI |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.025 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
type | NOR TYPE |
width | 5 mm |
write protect | HARDWARE/SOFTWARE |