Part Number |
PIC16F1455-E/ML |
PIC16F1455-E/P |
PIC16F1455-E/SL |
PIC16F1455-E/ST |
Description |
8-bit microcontrollers - mcu 14kb Fl 1024b R 48mhz int. Oc 12 I0 |
8-bit microcontrollers - mcu 14kb Fl 1024b R 48mhz int. Oc 12 I0 |
8-bit microcontrollers - mcu 14kb Fl 1024b R 48mhz int. Oc 12 I0 |
8-bit microcontrollers - mcu 14kb Fl 1024b R 48mhz int. Oc 12 I0 |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Maker |
Microchip |
Microchip |
Microchip |
Microchip |
package instruction |
HVQCCN, LCC16,.16SQ,25 |
DIP, DIP14,.3 |
SOP, SOP14,.25 |
TSSOP, TSSOP14,.25 |
Reach Compliance Code |
compliant |
compli |
compli |
compli |
Factory Lead Time |
13 weeks |
9 weeks |
12 weeks |
10 weeks |
Has ADC |
YES |
YES |
YES |
YES |
bit size |
8 |
8 |
8 |
8 |
boundary scan |
NO |
NO |
NO |
NO |
CPU series |
PIC16 |
PIC16 |
PIC16 |
PIC16 |
maximum clock frequency |
20 MHz |
20 MHz |
20 MHz |
20 MHz |
DAC channel |
YES |
YES |
YES |
YES |
DMA channel |
NO |
NO |
NO |
NO |
Format |
FIXED-POINT |
FIXED-POINT |
FIXED-POINT |
FIXED-POINT |
Integrated cache |
NO |
NO |
NO |
NO |
JESD-30 code |
S-PQCC-N16 |
R-PDIP-T14 |
R-PDSO-G14 |
R-PDSO-G14 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
length |
4 mm |
19.05 mm |
8.65 mm |
5 mm |
low power mode |
YES |
YES |
YES |
YES |
Number of external interrupt devices |
1 |
1 |
1 |
1 |
Number of I/O lines |
11 |
11 |
11 |
11 |
Number of serial I/Os |
1 |
1 |
1 |
1 |
Number of terminals |
16 |
14 |
14 |
14 |
Number of timers |
4 |
4 |
4 |
4 |
On-chip data RAM width |
8 |
8 |
8 |
8 |
On-chip program ROM width |
14 |
14 |
14 |
14 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
PWM channel |
YES |
YES |
YES |
YES |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVQCCN |
DIP |
SOP |
TSSOP |
Encapsulate equivalent code |
LCC16,.16SQ,25 |
DIP14,.3 |
SOP14,.25 |
TSSOP14,.25 |
Package shape |
SQUARE |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
260 |
260 |
RAM (bytes) |
1024 |
1024 |
1024 |
1024 |
RAM (number of words) |
1024 |
1024 |
1024 |
1024 |
rom(word) |
8192 |
8192 |
8192 |
8192 |
ROM programmability |
FLASH |
FLASH |
FLASH |
FLASH |
Maximum seat height |
1 mm |
5.334 mm |
1.75 mm |
1.2 mm |
speed |
48 MHz |
48 MHz |
48 MHz |
48 MHz |
Maximum slew rate |
107 mA |
107 mA |
107 mA |
107 mA |
Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
Nominal supply voltage |
3 V |
3 V |
3 V |
3 V |
surface mount |
YES |
NO |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Terminal form |
NO LEAD |
THROUGH-HOLE |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
2.54 mm |
1.27 mm |
0.65 mm |
Terminal location |
QUAD |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
NOT SPECIFIED |
40 |
40 |
width |
4 mm |
7.62 mm |
3.9 mm |
4.4 mm |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
Humidity sensitivity level |
1 |
- |
1 |
1 |