Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | QFN |
package instruction | HVQCCN, LCC64,.35SQ,20 |
Contacts | 64 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Factory Lead Time | 1 week |
Has ADC | YES |
Other features | ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ |
Address bus width | |
bit size | 16 |
boundary scan | YES |
CPU series | MSP430 |
maximum clock frequency | 32 MHz |
DAC channel | NO |
DMA channel | YES |
External data bus width | |
Format | FIXED POINT |
Integrated cache | NO |
JESD-30 code | S-PQCC-N64 |
JESD-609 code | e4 |
length | 9 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of DMA channels | 3 |
Number of external interrupt devices | |
Number of I/O lines | 47 |
Number of serial I/Os | 4 |
Number of terminals | 64 |
Number of timers | 4 |
On-chip data RAM width | 8 |
On-chip program ROM width | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | HVQCCN |
Encapsulate equivalent code | LCC64,.35SQ,20 |
Package shape | SQUARE |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 2/3.3 V |
Certification status | Not Qualified |
RAM (bytes) | 8192 |
RAM (number of words) | 8 |
rom(word) | 32768 |
ROM programmability | FLASH |
Maximum seat height | 1 mm |
speed | 25 MHz |
Maximum slew rate | 11 mA |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 2.4 V |
Nominal supply voltage | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 9 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |
Base Number Matches | 1 |